Single plate over-temperature treatment method and device
A processing method and a technology of a processing device, which are applied in the field of communication, can solve problems such as chip burnout, and achieve the effect of avoiding chip burnout
Inactive Publication Date: 2016-12-28
ZTE CORP
View PDF7 Cites 6 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
[0012] The present invention provides a single board over-temperature treatment method and device to at least solve the problem in the related art that only the temperature of the fixed chip on the single board can be detected and other chips may be burned.
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0032] Hereinafter, the present invention will be described in detail with reference to the drawings and examples. It should be noted that, in the case of no conflict, the embodiments in the present application and the features in the embodiments can be combined with each other.
[0033] It should be noted that the terms "first" and "second" in the description and claims of the present invention and the above drawings are used to distinguish similar objects, but not necessarily used to describe a specific sequence or sequence.
[0034] In this embodiment, a single board over-temperature treatment method is provided, figure 1 is a flow chart of a single board over-temperature processing method according to an embodiment of the present invention, such as figure 1 As shown, the process includes the following steps:
[0035] Step S102, acquiring the temperature detected by the temperature detection points on the single board, where more than two temperature detection points are ...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
The invention provides a single plate over-temperature treatment method and device. The method comprises the steps that temperatures detected at temperature detection points on a single plate are acquired, wherein two or more temperature detection points are arranged on the single plate; whether the first temperature detection point exists on the single plate or not is judged, wherein the temperature detected at the first temperature detection point exceeds a power-off threshold value temperature corresponding to the first temperature detection point; on the condition that a judgment result is yes, the single plate is treated according to over-temperature protection actions corresponding to the single plate, wherein the over-temperature protection actions comprise single plate resetting and / or single plate power-off. According to the method and device, the problem that in a related technique, other chips are possibly burnt down due to the fact that only the temperature of a fixed chip on the single plate can be detected is solved, and then the effects that multiple chips on the single plate are detected, and the problem that the chips are burnt down is avoided are achieved.
Description
technical field [0001] The present invention relates to the communication field, in particular, to a single board overtemperature processing method and device. Background technique [0002] In the context of the continuous and rapid development of the communication field, large-scale communication equipment carrying communication capabilities has also been updated. The greater the communication capability, the higher the hardware requirements for communication equipment, and at the same time, the more heat generated by the single board in the equipment. Therefore, how to effectively dissipate heat has become one of the key factors for the stable operation of communication equipment. [0003] In a general large-scale communication equipment system, in order to better solve the heat dissipation problem of the equipment board, the fan cooling technology is basically adopted. However, when the fan on the device fails, or the air inlet and outlet of the heat dissipation are blo...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Applications(China)
IPC IPC(8): G05D23/30
CPCG05D23/30
Inventor 李可
Owner ZTE CORP