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Cutting apparatus

A technology of cutting device and cutting knife, which is applied to the inspection of the tip of the knife. field, which can solve the problem that the vertical crack only extends locally

Active Publication Date: 2017-01-04
MITSUBOSHI DIAMOND IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When a scribe line is formed, there may be a case where the vertical crack extends completely in the thickness direction and the substrate is divided, but there is also a case where the vertical crack extends only partially in the thickness direction.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0031]

[0032] figure 1 and figure 2 It is a figure which shows the main part of the cutting apparatus 100 which concerns on embodiment of this invention. The cutting device 100 includes: a platform 1 for placing the substrate W in a horizontal posture; a cutting blade 2 for breaking the substrate W by pressing against the substrate W; and a chuck 3 for fixing the substrate W placed on the platform 1 substrate. The cutting device 100 is a device that cuts a substrate W on which a scribe line SL has been formed in advance using a cutting blade 2 to extend a crack (vertical crack) from the scribe line SL in the thickness direction of the substrate W, thereby cutting the substrate W. Break along the scribe line SL.

[0033] The substrate W includes brittle materials such as glass substrates, ceramic substrates, and semiconductor substrates. The thickness and size are not particularly limited, but typically, a thickness of about 0.4 mm to 1.0 mm or a size of about 50 mm to...

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PUM

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Abstract

The invention provides a cutting apparatus which enables a tool point to be checked without dismounting a cutting tool. The invention provides an apparatus for cutting a substrate along a marking line. The apparatus comprises a platform carrying a substrate horizontally; a cutting tool arranged above the platform in a manner of being capable of advancing and retreating freely; a camera device configured to be capable of capturing images of the tool point of the cutting tool; a tool point detecting device which detects whether the tool point of the cutting tool has missing parts according to one or more shooting images of the tool point obtained through shooting of the camera device. The tool point detecting device judges whether the tool point has missing parts based on whether judging indexes generated based on the one or more shooting images exceed stipulated judging standards.

Description

technical field [0001] The invention relates to a cutting device used for cutting a substrate, in particular to a cutting tool tip inspection used in the cutting device. Background technique [0002] Generally, the manufacturing process of a flat panel display panel or a solar cell panel includes a step of breaking a substrate (mother substrate) containing a brittle material such as a glass substrate, a ceramic substrate, or a semiconductor substrate. The splitting method is widely used in which a scribe line is formed on the surface of the substrate using a scribe tool such as a diamond point or a cutter wheel, and a crack (vertical crack) extends from the scribe line in the thickness direction of the substrate. When scribe lines are formed, there are cases where the vertical cracks completely extend in the thickness direction and the substrate is divided, but there are also cases where the vertical cracks extend only partially in the thickness direction. In the latter cas...

Claims

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Application Information

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IPC IPC(8): B28D5/04B28D5/00G01N21/88
CPCG01N21/8851B28D5/0058B28D5/045G01N2021/8887Y02P40/57
Inventor 时本育往吉田圭吾
Owner MITSUBOSHI DIAMOND IND CO LTD