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Semiconductor device and manufacturing method thereof

A technology of semiconductors and conductive pillars, which is applied in semiconductor/solid-state device manufacturing, semiconductor devices, semiconductor/solid-state device components, etc., and can solve problems such as large package size, reduced reliability, and inappropriate methods

Active Publication Date: 2017-01-04
AMKOR TECH INC DW US
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Current semiconductor devices and methods for manufacturing semiconductor devices are inappropriate, for example, resulting in excessive cost, reduced reliability, or excessive package size

Method used

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  • Semiconductor device and manufacturing method thereof
  • Semiconductor device and manufacturing method thereof
  • Semiconductor device and manufacturing method thereof

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Embodiment Construction

[0012] The following discussion presents various aspects of the invention by providing examples thereof. Such examples are non-limiting, and thus the scope of the various aspects of the invention should not necessarily be limited by any particular feature of the examples provided. In the following discussion, the phrases "for example," "for example," and "exemplary" are non-limiting and are generally synonymous with "by way of example and not limitation," "for example and without limitation," and the like.

[0013] As used herein, "and / or" means any one or more of the items in the list joined by "and / or". As an example, "x and / or y" means any element in the three-element set {(x), (y), (x, y)}. In other words, "x and / or y" means "either or both of x and y". As another example, "x, y, and / or z" means the seven-element set {(x), (y), (z), (x, y), (x, z), (y, z), Any element in (x,y,z)}. In other words, "x, y, and / or z" means "one or more of x, y, and z."

[0014] The termin...

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Abstract

A semiconductor device and a method of manufacturing a semiconductor device. As a non-limiting example, various aspects of this disclosure provide a semiconductor device, and method of manufacturing thereof, that comprises a redistribution structure formed on a stiffening layer.

Description

[0001] CROSS-REFERENCE / INCORPORATION BY REFERENCE TO RELATED APPLICATIONS [0002] This application refers to Korean Patent Application No. 10-2015-0089245 filed with the Korean Intellectual Property Office on June 23, 2015, and entitled "SEMICONDUCTOR DEVICE", claiming priority and rights thereto, said patent application The contents are hereby incorporated by reference in their entirety. technical field [0003] The present invention relates to a semiconductor device and a method of manufacturing the semiconductor device. Background technique [0004] Current semiconductor devices and methods for manufacturing semiconductor devices are inadequate, eg, resulting in excessive cost, reduced reliability, or excessive package size. Additional limitations and disadvantages of such methods will become apparent to those skilled in the art by comparing conventional and traditional methods with the present invention set forth in the remainder of this application with reference to ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/00H01L23/522H01L21/768
CPCH01L21/76898H01L23/5226H01L23/562H01L25/0655H01L2224/16227H01L2224/32225H01L2224/73204H01L2224/73253H01L2224/92125H01L2924/15311H01L2924/15313H01L2924/16251H01L2924/18161H01L2924/19105H01L2924/35121H01L23/147H01L23/49811H01L23/49822H01L21/4857H01L23/5383H01L23/49827H01L23/49816H01L21/486H01L2224/16225H01L2924/00
Inventor 李旺求培中希姜成根宋洋李武刚真纳莱
Owner AMKOR TECH INC DW US