A waterfall developing nozzle
A waterfall and waterfall technology, applied in the processing of photosensitive materials, etc., can solve the problems of secondary pollution of wafers, poor development results, unclean development, etc., and achieve the effect of large supply flow, avoiding the influence of residual drops, and shortening the time for filling wafers
Active Publication Date: 2019-06-11
SHENYANG KINGSEMI CO LTD
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Problems solved by technology
During the development process, the reaction between the developer and the photoresist will produce dirt. The dirt generally floats on the surface of the developer. When the developer is sprayed at a close distance, the dirt will inevitably contaminate the nozzle, resulting in secondary pollution of the wafer and development. Unclean and poor developing results, so the developing nozzle is required to be easy to clean to prevent secondary pollution of the wafer
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[0019] The present invention will be described in further detail below in conjunction with the accompanying drawings.
[0020] Such as figure 1 As shown, the present invention comprises a liquid separation pipeline 1, a buffer tank 2 and a waterfall forming column 3, wherein one end of the buffer tank 2 is provided with an opening, and the waterfall forming column 3 is arranged at the opening of the buffer tank 2 and is connected with the buffer tank 2 abutting, the height of the waterfall forming column 3 is lower than the height of the buffer tank 2, one end of the liquid separation pipe 1 is inserted in the buffer tank 2, and the other end is connected with the developer pressure supply device arranged outside the buffer tank 2 9 connection, the liquid distribution pipeline 1 is provided with an open and close suction valve 8. The developer solution pressure supply device 9 transports the developer solution 7 to the buffer tank 2 through the liquid separation pipeline 1. W...
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The invention belongs to the technical field of chemical liquid spraying process, and specifically discloses a waterfall type developing nozzle. The waterfall type developing nozzle comprises a liquid separation pipeline, a buffering groove and a waterfall forming column, wherein an opening is formed in one end of the buffer groove; the waterfall forming column is arranged in an opening of the buffer groove, and abuts against the buffer groove; the height of the waterfall forming column is lower than that of the buffer groove; one end of the liquid separation pipeline is inserted into the buffer groove while the other end of the liquid separation pipeline is connected with a developing liquid pressure supply apparatus on the exterior of the buffer groove; the developing liquid pressure supply apparatus is conveyed to the buffer groove through the liquid separation pipeline; and when the height of the liquid surface of the developing liquid in the buffer groove is higher than that of the waterfall forming column, the developing liquid flows out of the outer surface of the waterfall forming column. The waterfall type developing nozzle provided by the invention is large in chemical liquid supply amount, low in spraying impact force, short in time of fully immersing the developing liquid into crystal lattices, and continuous in chemical liquid spraying; and meanwhile, the nozzle can be cleaned and dried conveniently.
Description
technical field [0001] The invention belongs to the technical field of spraying chemical liquid, in particular to a waterfall developing nozzle. Background technique [0002] Today's semiconductor chip manufacturing process is still dominated by lithography, that is, the method of forming small lines is still through the process of uniform glue, exposure, and development. After forming tiny patterns, etching or electroplating are performed to form small metal circuit. [0003] Development is a necessary process step in the photolithography process of microelectronic chip manufacturing. As the line width of integrated circuits becomes smaller and the chip manufacturing process progresses, the line width becomes smaller and smaller, the photoresist becomes thinner, and the development process window becomes smaller. The smaller it is, the shorter the time it takes to spray the developer and cover the surface of the wafer is better. Because the film becomes thinner and the li...
Claims
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IPC IPC(8): G03F7/30
Inventor 张怀东
Owner SHENYANG KINGSEMI CO LTD