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Transistor packaging body testing seat with adjustable testing groove and operating method thereof

A package and transistor technology, used in semiconductor/solid state device testing/measurement, electrical components, circuits, etc., can solve the problems of left and right offset packages, easy stacking, etc., so as to improve the average test yield and eliminate stacking. hidden dangers and the effect of improving productivity

Active Publication Date: 2017-01-18
CHANGJIANG ELECTRONICS TECH CHUZHOU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Aiming at the problems existing in the prior art that the pins of the transistor package are shifted left and right when they contact the test piece and the package is easy to be stacked after the test is completed, the invention provides a transistor package with adjustable test grooves Body test socket and its operation method

Method used

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  • Transistor packaging body testing seat with adjustable testing groove and operating method thereof
  • Transistor packaging body testing seat with adjustable testing groove and operating method thereof
  • Transistor packaging body testing seat with adjustable testing groove and operating method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0049] The test seat of the test groove adjustable transistor package in this embodiment includes a fixed clip 1, a collar 3, a connecting push rod 9, and a movable clip 2; the fixed clip 1 and the movable clip 2 are connected by a rotating device that cooperates with each other, and The width adjustment of the jaw 111 between the two is realized by the rotation of the movable clamp 2 relative to the fixed clamp 1; as Figure 5 , 7 As shown, the rotating device is a convex semi-cylinder 12 and a concave semi-cylindrical 22 that are respectively arranged on the respective sides facing the fixed clip 1 and the movable clip 2 and are matched with each other; On the semi-cylindrical 12, the concave semi-cylindrical 22 rotates around the convex semi-cylindrical 12, so that the clamp 111 of the test seat can be adaptively adjusted according to the size of the transistor package 8, thereby improving the average test yield of the transistor package 8 the goal of. Because the overall...

Embodiment 2

[0051] The basic structure of the transistor package test seat with adjustable test grooves in this embodiment is the same as in Embodiment 1, the differences and improvements are as follows: figure 1 As shown, there is an "L"-shaped rotation gap 112 between the movable clip 2, the fixed clip 1 and the collar 3, and the gap is "L"-shaped, which realizes the small-angle rotation of the concave semi-cylindrical with the convex semi-cylindrical as the axis. Such as Image 6 As shown, the lower half of the movable clip 2, the lower part of the concave half cylinder 22 is provided with a horizontal spring chamber 25, and a horizontal jaw width adjustment spring 23 is built in. In order to realize the reset of the width of the clamp 111 after the test of the transistor package is completed, and realize the clamping force of the clamp 111 on the transistor package during the test, so as to ensure the stability of the position of the transistor package during the test.

Embodiment 3

[0053] The basic structure of the transistor package test socket with adjustable test groove of this embodiment is the same as that of Embodiment 2, the differences and improvements are as follows: Figure 5 As shown, a vertical ejector rod cavity 15 is arranged inside the middle of the fixing clip 1, and the ejector rod spring and the ejector rod 4 connected to each other are built from bottom to top; as Figure 10 As shown, the ejector pin 4 is in the shape of a "convex", the top end passes through the upper surface of the fixing clip 1, near the middle of the jaw 111, and the bottom is the ejector pin seat 41 connected to the ejector pin spring, so as to ensure the completion of the test of the transistor package product After that, it will not be stuck in the test socket, thereby reducing the probability of stacking alarms at the test station. The lower surface of the fixed clip 1 is fixedly provided with a connecting block 17, and is detachably connected with the connecti...

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PUM

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Abstract

The invention, which belongs to the technical field of chip testing, discloses a transistor packaging body testing seat with an adjustable testing groove and an operating method thereof. The testing seat comprises a fixed clamp, a collar unit, a push rod and a movable clamp. The fixed clamp and the movable clamp are connected by a rotating unit in mutual cooperation; and the clamping opening width between the fixed clamp and the movable clamp is realized based on rotation of the movable clamp relative to the fixed clamp. The total height of the fixed clamp is larger than that of the movable clamp and the tops of the two clamps are flush with each other. The collar unit sleeves the fixed clamp from the bottom of the fixed clamp; the collar unit and the fixed clamp are in an up-down clearance fit relation and are fixed on a testing bench based by fixation holes penetrating the collar unit vertically. A connecting top rod is fixed at the bottom of the fixed clamp; a circular-hole-included base is arranged right below the connecting top rod; and a large spring sleeves the connecting top rod and is in an up-down clearance fit relation with the circular hole of the base. On the basis of cooperation of the collar unit and the connecting top rod, functions of material folding prevention and prevention of excessive rising of the overall testing seat are realized. According to the invention, an objective of increasing an average testing yield of the transistor packaging body is achieved.

Description

technical field [0001] The invention relates to the technical field of chip testing, in particular to a test seat for a transistor package body with adjustable test grooves and an operating method thereof. Background technique [0002] At present, in the semiconductor integrated circuit manufacturing process, it is necessary to further test the finished chip after cutting and packaging, and the test fixture plays a key role. During the chip testing process, the specific method is to transfer the chip to the test clip through the suction nozzle of the chip sorter. After the test is completed, the suction nozzle of the chip sorter transfers the chip to the next process. [0003] SOT is the abbreviation of English Small-outlinetransistor, which refers to a transistor packaging form, SOT26 is the abbreviation of SOT23-6, SOT23-6 is a kind of SOT23, the mantissa 6 means 6 pins; the original equipment design test clips such as figure 2 As shown, the opening size of the clamp (11...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/66
CPCH01L22/34Y02E10/50
Inventor 李国祥承龙李青叶金锋邱冬冬
Owner CHANGJIANG ELECTRONICS TECH CHUZHOU