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A kind of preparation method of glue solution for p10 copper clad laminate

A technology of copper clad laminate and glue, applied in the field of preparation of glue for P10 copper clad laminate, can solve the problems of acid and alkali resistance and heat resistance of LED light radiation output weakening, high cost, and achieve excellent acid and alkali resistance, good Heat resistance, good adhesion effect

Active Publication Date: 2019-03-08
SHANGHAI GUOJI ELECTRONICS MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The technical problem solved by the present invention is to overcome the defects of high cost, acid and alkali resistance and heat resistance of the existing P10 copper clad laminates, and the weakening of the LED light radiation output due to the reduction of the transparency of the epoxy resin due to high temperature, and provides a P10 Glue for copper clad laminate, prepreg, copper clad laminate and preparation method

Method used

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  • A kind of preparation method of glue solution for p10 copper clad laminate

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0052] The raw material formula of glue for P10 copper clad laminate is as follows:

[0053] 370 parts of bisphenol A liquid epoxy resin, 160 parts of bisphenol A liquid epoxy resin, 200 parts of phenolic resin (softening point is 95-100°C), 0.20 parts of 2-phenylimidazole, 0.15 parts of 2-methylimidazole 140 parts of acetone, 100 parts of butanone, 130 parts of propylene glycol methyl ether, 300 parts of aluminum hydroxide, 100 parts of soft silicon, 50 parts of talcum powder and 0.5 parts of fluorescent whitening agent.

[0054] The preparation method of glue is as follows:

[0055] (1) Acetone, butanone and propylene glycol methyl ether were stirred at a rotating speed of 500rpm for 0.1 hour to obtain a mixed solvent; half of the mixed solvent was mixed with solid epoxy resin, and stirred for 6 hours at a rotating speed of 1500 to obtain a mixture A; The mixed solvent was mixed with the phenolic resin, and stirred at a speed of 1500 rpm for 6 hours to obtain a mixture B; ...

Embodiment 2

[0075] The raw material formula of glue for P10 copper clad laminate is as follows:

[0076] 350 parts of bisphenol A liquid epoxy resin, 150 parts of bisphenol A solid liquid epoxy resin, 205 parts of phenolic resin (softening point is 95-100°C), 0.10 parts of 2-phenylimidazole, 2-methylimidazole 0.25 parts, 130 parts of acetone, 110 parts of butanone, 130 parts of propylene glycol methyl ether, 350 parts of aluminum hydroxide, 150 parts of silicon dioxide, 60 parts of talcum powder and 0.6 parts of fluorescent whitening agent.

[0077] The preparation method of glue is as follows:

[0078] (1) Acetone, butanone and propylene glycol methyl ether were stirred at a rotating speed of 800rpm for 0.2 hours to obtain a mixed solvent; 40% of the mixed solvent was mixed with a solid epoxy resin, and stirred at a rotating speed of 2000rpm for 8 hours to obtain a mixture A; The mixed solvent was mixed with the phenolic resin, and stirred at a speed of 2000rpm for 8 hours to obtain a m...

Embodiment 3

[0098] The raw material formula of glue for P10 copper clad laminate is as follows:

[0099] 300 parts of bisphenol A liquid epoxy resin, 200 parts of bisphenol A solid epoxy resin, 210 parts of phenolic resin (softening point is 95-100°C), 0.25 parts of 2-phenylimidazole, 0.10 parts of 2-methylimidazole 140 parts of acetone, 120 parts of butanone, 100 parts of propylene glycol methyl ether, 400 parts of aluminum hydroxide, 130 parts of silicon micropowder, 70 parts of talcum powder and 0.4 parts of fluorescent whitening agent.

[0100] The preparation method of glue is as follows:

[0101](1) Acetone, butanone and propylene glycol methyl ether were stirred at a rotating speed of 600rpm for 0.15 hours to obtain a mixed solvent; 40% of the mixed solvent was mixed with a solid epoxy resin, and stirred for 7 hours at a rotating speed of 1800rpm to obtain a mixture A; The mixed solvent was mixed with the phenolic resin, and stirred at a speed of 1800rpm for 7 hours to obtain a mi...

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Abstract

The invention discloses a preparation method of an adhesive solution used for P10 copper clad laminate. The method comprises the following steps: 1, mixing a mixture A with liquid epoxy resin under a stirring condition, shearing the mixture A and the liquid epoxy resin at 2500-3000 rpm for 3-5 h, and mixing the obtained mixture with a mixture B to obtain a mixture C, wherein the mixture A is obtained through mixing solid epoxy resin with 40-60% of a solvent, and the mixture B is obtained through mixing phenolic resin with remaining solvent; and 2, mixing the mixture C, a solidification promoter and a fluorescence whitening agent., mixing the obtained mixture with an inorganic filler, shearing the mixture and the inorganic filler at 2000-3000 rpm, and slaking the obtained shearing material to obtain the adhesive solution. The adhesive solution prepared through the preparation method has the advantages of good adhesion, good anti-ultraviolet function, very good heat resistance, excellent acid and alkali resistance and excellent solvent resistance.

Description

technical field [0001] The invention relates to a method for preparing glue for P10 copper clad laminates. Background technique [0002] In recent years, a class of copper-clad laminates (P10 copper-clad laminates) with excellent UV discoloration resistance and heat discoloration resistance and high LED light radiation output have been rapidly developed in the field of LED (light-emitting diode) applications. It has become a class of products that meet special performance requirements in copper clad laminates. [0003] However, as the temperature rises, the transparency of the epoxy resin will decrease significantly. Barton found that when the temperature reaches 140°C, the epoxy resin is seriously degraded, which affects the service life of the LED lamp. When the temperature reaches 150°C, the transparency of the epoxy resin decreases significantly, resulting in The radiant output of the LED light is reduced. [0004] At present, the addition of an appropriate amount of i...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L63/00C08L61/06C08K3/22C08K3/36C08K3/34C08J5/04C08G59/62B32B37/06B32B37/16B32B37/10B32B17/02
CPCB32B5/26B32B37/06B32B37/10B32B37/16B32B2262/101B32B2307/306B32B2307/71B32B2307/752C08G59/62C08J5/043C08J2363/00C08L63/00C08L2201/08C08L2203/20C08L2205/025C08L2205/03C08L61/06C08K2003/2227C08K3/36C08K3/34
Inventor 李清亮吴兰中
Owner SHANGHAI GUOJI ELECTRONICS MATERIALS CO LTD