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Radio frequency identification in-metal installation and isolation for sputtering target

A technology of sputtering target and medium, applied in the field of sputtering target/pad assembly, can solve the problems affecting RF signal reception and transmission, formulation changes, disadvantages, etc.

Inactive Publication Date: 2017-02-22
东曹SMD有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Further, epoxy formulations vary and often introduce air pockets that adversely affect RF signal acceptance and transmission

Method used

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  • Radio frequency identification in-metal installation and isolation for sputtering target
  • Radio frequency identification in-metal installation and isolation for sputtering target
  • Radio frequency identification in-metal installation and isolation for sputtering target

Examples

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Embodiment Construction

[0027] Go to attached figure 1 , shows the water side or back side of the backing plate 2. It should be noted that a sputtering target (not shown) is placed along the side of the backing plate 2 opposite to the back side, and that the flange of the target overlaps the outer periphery of the backing plate 2 . figure 1 The side of the backing plate 2 shown in is often referred to as the water side, since a cooling water loop or similar design acts on the backing plate here to remove heat from the overlapping targets during operation.

[0028] View further figure 1 , a socket 4 is provided in this water side of the backing plate. The socket comprises a groove 6 formed around the socket. The RFID chip is shown as 8 in this figure and, as can be seen, is interposed between the chip housing (ie plug) 10 and the bottom surface of the socket 4 . An O-ring 12 is provided around the plug and is adapted to be received in a groove 6 formed in the backing plate.

[0029] figure 2 Fu...

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PUM

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Abstract

A RFID tag containment combination for a sputter target / backing plate assembly. A bore is provided in either the target or the backing plate and is adapted for snug receipt of a plug therein. The plug comprises a recessed portion thereof configured to carry the RFID tag therein.

Description

[0001] Cross References to Related Applications [0002] This application claims the benefit of priority to U.S. Provisional Patent Application Serial No. 62 / 004,939, filed May 30, 2014, and U.S. Provisional Patent Application Serial No. 62 / 092,419, filed December 16, 2014. technical field [0003] The present invention pertains to a sputtering target / backing plate assembly provided with an RFID tag configured to accurately place a plug for a chip in read / write communication with an RFID reader and a corresponding A bore (bore) is embedded in the target or backing plate. Background technique [0004] Radio frequency identification (RFID) technology is used in a variety of environments to provide wireless automated identification and movement of a variety of commodities. RFID systems typically include a transponder (called a "tag") mounted to an item or device to be identified, and a "tag" reader in communication with the transponder. [0005] In many cases, a tag or transp...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06K19/07G06K19/077
CPCC23C14/3407H01J37/34H01J37/3405H01J37/32935H01J37/3417G06K19/07749
Inventor J.K.里德E.西多K.菲尔德G.史蒂文斯R.A.迪利J.H.伯利
Owner 东曹SMD有限公司