Radio frequency identification in-metal installation and isolation for sputtering target
A technology of sputtering target and medium, applied in the field of sputtering target/pad assembly, can solve the problems affecting RF signal reception and transmission, formulation changes, disadvantages, etc.
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[0027] Go to attached figure 1 , shows the water side or back side of the backing plate 2. It should be noted that a sputtering target (not shown) is placed along the side of the backing plate 2 opposite to the back side, and that the flange of the target overlaps the outer periphery of the backing plate 2 . figure 1 The side of the backing plate 2 shown in is often referred to as the water side, since a cooling water loop or similar design acts on the backing plate here to remove heat from the overlapping targets during operation.
[0028] View further figure 1 , a socket 4 is provided in this water side of the backing plate. The socket comprises a groove 6 formed around the socket. The RFID chip is shown as 8 in this figure and, as can be seen, is interposed between the chip housing (ie plug) 10 and the bottom surface of the socket 4 . An O-ring 12 is provided around the plug and is adapted to be received in a groove 6 formed in the backing plate.
[0029] figure 2 Fu...
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