Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Flexible circuit on reflective substrate

A flexible circuit and reflective film technology, which is applied in the direction of circuits, electrical components, electric solid devices, etc., can solve problems such as short circuit of circuit board conductors

Inactive Publication Date: 2017-02-22
3M INNOVATIVE PROPERTIES CO
View PDF6 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, applying a reflective metal coating to the surface of a circuit board can be problematic because the metal can short circuit board conductors

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Flexible circuit on reflective substrate
  • Flexible circuit on reflective substrate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] A silicone polyoxamide-based mirror having polyethylene terephthalate (PET) as a high Refractive index material and skin and polydiorganosiloxane-polyoxamide thermoplastic silicone elastomer as 275 alternating layers of low refractive index material. A "bond" layer of about 5 nm of chromium was deposited on the silicone polyoxamide-based mirror, and then a "seed" layer of about 250 nm of copper was deposited on the "bond" layer, both using a Batch coater. The copper is then plated using an electroplating process to a thickness of approximately 18 microns to 20 microns of copper. Pattern the LED circuit onto the copper surface and film. The circuit is approximately 230mm long with two power busses approximately 1mm wide and spaced approximately 10mm apart connecting the LED circuit running between the buses. Etching the film in a ferric chloride bath to remove unpatterned copper, and then etching the film in a mixture of potassium permanganate and potassium hydroxide ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
Melting pointaaaaaaaaaa
Melting pointaaaaaaaaaa
Login to View More

Abstract

The present disclosure describes materials and methods for creating electrical circuits on a non-conductive multilayer reflector substrate that can withstand reflow temperatures with low temperature solder pastes without creating distortions in the reflective substrate. The materials and methods include the use of a novel reflective mirror film based on silicone polyoxamide polymers or copolymers, which can retain reflectivity at these temperatures without damage to reflection or other film properties.

Description

Background technique [0001] In many lighting applications, it is desirable to combine LEDs with reflective surfaces in order to produce highly efficient light sources. While a typical circuit board with mounted LEDs may be coated with a reflective material such as white ink, epoxy, or paint, these surfaces typically only have reflectance values ​​in the range of 70% to 90%. Furthermore, these types of surfaces are often diffusely reflective, and scattering light can actually reduce efficiency in some lighting systems. A specularly reflective surface, such as metal, can help direct reflected light in complementary directions, thereby increasing efficiency. However, applying a reflective metal coating to the surface of a circuit board can be problematic because the metal can short circuit board conductors. Contents of the invention [0002] The present disclosure describes materials and methods for creating circuits on non-conductive multilayer reflector substrates that can ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01L33/60H01L33/46
CPCH01L33/46H01L33/60H01L33/005H01L33/10H01L33/62H01L2924/12041H01L2933/0025H01L2933/0058
Inventor M·A·梅斯
Owner 3M INNOVATIVE PROPERTIES CO
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products