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Two-substrate fingerprint recognition device

一种指纹辨识、基板的技术，应用在获取/整理指纹/掌纹、字符和模式识别、仪器等方向，能够解决电容式传感器感测效率不佳、厚度小等问题

Active Publication Date: 2017-03-01
SUPERC TOUCH CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Since the sapphire substrate has sufficient hardness, its thickness can be made smaller than the cover glass to solve the problem of poor sensing efficiency of capacitive sensors in the past

Method used

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  • Two-substrate fingerprint recognition device
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  • Two-substrate fingerprint recognition device

Examples

Experimental program
Comparison scheme
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Embodiment Construction

[0046] figure 1 It is a schematic cross-sectional view of an embodiment of a dual-substrate fingerprint identification device 100 of the present invention. figure 2 It is a top view of an embodiment of a dual-substrate fingerprint identification device 100 of the present invention. figure 2 It is a schematic diagram looking down from the direction of the finger. Please also refer to figure 1 and figure 2 , the dual-substrate fingerprint identification device 100 includes a first substrate 110 , a second substrate 120 , and a fingerprint sensing circuit 130 . A plurality of electrodes 111 , a plurality of conductive connection pads 113 and a plurality of traces 115 are disposed on one side of the first substrate 110 . The first substrate 110 can be a glass substrate, ceramic substrate, sapphire substrate or polymer material substrate. The plurality of electrodes 111 , the plurality of conductive connection pads 113 and the plurality of wires 115 of the first substrate 1...

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PUM

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Abstract

The invention provides a two-substrate fingerprint recognition device. A two-substrate fingerprint recognition device includes a first substrate and a second substrate. A plurality of electrodes, a plurality of connection pads and a plurality of connection traces are deployed on one surface of the first substrate. A plurality of conductive connection pads, a plurality of connection pads, a plurality of connection traces and a plurality of switch circuits are deployed on one surface of the second substrate that faces the first substrate. At least one electrode connection pad of the second substrate is electrically connected to a corresponding electrode of the first substrate.

Description

technical field [0001] The invention relates to the technical field of fingerprint identification devices, in particular to a double-substrate fingerprint identification device. Background technique [0002] Encouraged by Apple's introduction of fingerprint recognition applications in smart phones, the development of fingerprint recognition has recently set off an upsurge again. Common fingerprint sensors include capacitive and optical. [0003] Currently, fingerprint recognition sensors can be divided into semiconductor type and optical type according to the process method. Semiconductor chip sensor (SemiconductorSensor) generally refers to a fingerprint sensor manufactured by integrated circuit design and semiconductor process. Capacitive semiconductor fingerprint sensors integrate high-density capacitive sensors into one chip. When the fingerprint presses the surface of the chip, the capacitive sensor inside the chip will form a fingerprint image according to the diffe...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06K9/00
CPCG06V40/1306G06F2203/0338G06F3/0446G06F3/0445G06V40/1329
Inventor 李祥宇金上林丙村
Owner SUPERC TOUCH CORP