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Sputter device with moving target

一种溅镀、镀层的技术，应用在溅射镀覆、离子注入镀覆、真空蒸发镀覆等方向

Active Publication Date: 2017-03-08
SOLERAS ADVANCED COATINGS NV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] A problem that occurs in cluster coaters for sputtering large-area surfaces is the uniformity of the coating obtained

Method used

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  • Sputter device with moving target
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  • Sputter device with moving target

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Embodiment Construction

[0094] The present invention will be described with reference to particular embodiments and with reference to certain drawings but the invention is not limited thereto but only by the claims. The drawings described are only schematic and non-limiting. In the drawings, the size of some of the elements may be exaggerated and not drawn on scale for illustrative purposes. The dimensions and relative dimensions do not correspond to actual reproductions of the practice of the invention.

[0095] Furthermore, the terms first, second, etc. in the description and claims are used to distinguish between similar elements and not necessarily to describe an order in time, space, sequence or in any other way. It is to be understood that the terms so used are interchangeable under appropriate circumstances and that the embodiments of the invention described herein are capable of operation in other sequences than described or illustrated herein.

[0096] In addition, the terms top, bottom, e...

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Abstract

A sputter device (100) for depositing a layer on a substrate in a vacuum chamber, the layer having a layer property in each point of the substrate surface. The sputter device comprises at least one end block (120) adapted for each holding a cylindrical target (160) having a longitudinal axis in a first direction. The sputter device moreover comprises a first drive means (190) for providing a rotational movement of the at least one cylindrical target (160) around its longitudinal axis. The sputter device also comprises a second drive means (145) for applying a translational movement to the at least one end block (120) in a second direction, thereby keeping the target axis parallel during at least a significant portion of the movement trajectory along the second direction. The first and the second drive means are adapted for, during sputtering, being simultaneously operational in the vacuum chamber. The movement of the first drive means does not impact the uniformity of the layer sputtered on the substrate in the direction on the surface of the substrate corresponding to a perpendicular projection of the second direction onto the substrate (170).

Description

technical field [0001] The invention relates to the field of sputtering devices. More particularly, the present invention relates to sputtering devices for use in sputtering systems for coating large area surfaces comprising large area substrates or arrays of smaller substrates that together form a large area surface. Background technique [0002] When sputtering a 2-dimensional surface, for example for the manufacture of displays (eg TFT displays) or electronic devices, usually multiple coating layers are deposited, at least some of which comprise different materials. [0003] To this end, in prior art solutions, the substrate is physically moved from one sputtering chamber (in which one or more layers of the first material are deposited on the substrate) to another sputtering chamber ( One or more coatings of a different material are sputtered onto the same substrate in the further sputtering chamber). [0004] In a sputtering chamber, the substrate is typically held sub...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/34C23C14/56H01J37/34
CPCC23C14/34C23C14/3407C23C14/562H01J37/3414H01J37/3435H01J37/347H01J37/3417H01J37/342H01J37/345C23C14/542
Inventor W·德博斯谢尔I·范德普特
Owner SOLERAS ADVANCED COATINGS NV