Wafer carrying case and manufacturing method thereof
A carrier box and wafer technology, applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve problems such as damage to large wafers, and achieve the effect of avoiding damage, avoiding breakage, and good shock absorption.
Active Publication Date: 2019-05-03
SEMICON MFG INT TIANJIN +1
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Problems solved by technology
[0003] However, the materials used in FOSB in the prior art still have the defect of relatively large wafer damage. Therefore, it is necessary to provide a better FOSB for preventing external impact
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[0028] The wafer carrying case of the present invention and its manufacturing method will be described in more detail below in conjunction with schematic diagrams, wherein a preferred embodiment of the present invention is represented, and it should be understood that those skilled in the art can modify the present invention described herein while still implementing the present invention. Beneficial effects of the invention. Therefore, the following description should be understood as the broad knowledge of those skilled in the art, but not as a limitation of the present invention.
[0029] In the following paragraphs the invention is described more specifically by way of example with reference to the accompanying drawings. Advantages and features of the present invention will be apparent from the following description and claims. It should be noted that all the drawings are in a very simplified form and use imprecise scales, and are only used to facilitate and clearly assist...
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Abstract
The invention provides a wafer carrying case and the manufacturing method thereof. The method comprises the following steps: synthesizing boron-siloxane; adding surfactant and additive to the boron-siloxane to form a mixed material; uniformly mixing the mixed material with a first polymer; injecting the material developed through the mixing of the mixed material with the first polymer and a second polymer into an injection machine where the first polymer and the second polymer are subject to a chemical reaction to be synthesized as an injection molding material and the mixed material is filled in the gaps of the injection molding material; and injecting the injection molding material into a wafer carrying case mold to develop a wafer carrying case. According to the invention, as hydrogen bonds are formed in the mixed material, when the wafer carrying case is subject to external impact, the hydrogen bonds break. In addition, the surfactant and additive in the mixed material make the wafer carrying case more adhesive, therefore dispersing external force and preventing the wafer from breakage. Beyond that, the breakage and formation of hydrogen bonds are reversible.
Description
technical field [0001] The invention relates to the technical field of semiconductor manufacturing, in particular to a material wafer carrying case and a preparation method thereof. Background technique [0002] During the production process of wafers in semiconductor manufacturing plants, wafers often need to be moved. In order to better protect the wafer during the handling process, a Front Opening Shopping Box (FOSB) is generally used to place the wafer. FOSB usually uses organic polymer materials, such as polyethylene succinate (PES), polycarbonate (PC), perfluoroalkoxy resin (PFA), high-density polyethylene (HDPE) or polyurethane (PU) ) and other materials. The shock absorption effect of organic polymer materials is used to avoid the phenomenon of wafer fracture and damage during external impact. [0003] However, the materials used in the FOSB in the prior art still have the defect of relatively large damage to the wafer. Therefore, it is necessary to provide a FOSB...
Claims
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IPC IPC(8): H01L21/673
CPCH01L21/67386
Inventor 王芬王立众禹菲菲
Owner SEMICON MFG INT TIANJIN