A thermal evaluation system and method

Abstract

The invention relates to the technical field of wireless communication, and discloses a thermal evaluation system. The thermal evaluation system specifically includes a thermal evaluation plate which has identical three-terminal voltage-stabilizing tube A and three-terminal voltage-stabilizing tube B, the three-terminal voltage-stabilizing tube A being equipped with a radiator, and the thermal evaluation plate being used for detecting current, voltage and temperature in the working states of the three-terminal voltage-stabilizing tube A and the three-terminal voltage-stabilizing tube B and detecting environment temperature, and sending detection data to a computer system or single-chip microcomputer; the computer system or single-chip microcomputer used for processing data sent by the thermal evaluation plate, and establishing a thermal evaluation engineering function; and an interface board used for data transmission and level switch between the computer system or single-chip microcomputer and the thermal evaluation plate. The invention also discloses a thermal evaluation method of the abovementioned thermal evaluation system, directly calculates and determines related elements through a thermal evaluation engineering function relational expression, avoids a complicated test investigation link, improves efficiency, saves cost, and ensures the success rate of a thermal design scheme.

Description

technical field [0001] The invention relates to the technical field of wireless communication, in particular to a thermal evaluation system and method. Background technique [0002] In the field of radio communication research, the heat dissipation problem caused by the design of high-power transmitting circuits has always been a difficult problem for designers, especially in the field of airborne communication products, this problem is particularly prominent. [0003] For this kind of problem, in the past heat dissipation design ideas, due to the looser structural size requirements, an extensive heat dissipation design scheme can be adopted, that is, the structural size of the radiator is much larger than the heat dissipation requirements of the heat source. This method does not have high requirements for the identification and analysis of heat sources, the calculation and demonstration of radiators, and the evaluation of heat dissipation effects. Therefore, the problem may...

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Problems solved by technology

[0008] However, with traditional thermal design concepts and engineering methods, it is impossible to solve the above three problems at all, or it is impossible to solve the above three problems systematically, so it cannot effectively solve the fundamental contradictions faced by thermal design.