Preparation method of fungiform samples for testing tensile strength of thermally-bonded metal rubber-coated parts
A tensile strength and metal-clad technology is applied in the field of preparing fungal samples for testing the tensile strength of thermally bonded metal-coated parts. The service life of bonding metal-coated parts and other problems can be improved to improve the qualification rate.
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[0017] In order to deepen the understanding of the present invention, the present invention will be described in further detail below in conjunction with embodiments and drawings. The embodiments are only used to explain the present invention and do not constitute a limitation on the protection scope of the present invention.
[0018] Metal encapsulated parts are widely used in the aviation and automotive fields. Adding rubber encapsulated parts to metal parts such as sealing, oil leakage, water leakage, and air leakage can improve the sealing performance. The fungus sample of the present invention is used as The test piece along with the furnace and the rubber-coated parts are placed on a flat vulcanizing machine for vulcanization. After vulcanization, the fungus-shaped sample is directly tested for tensile strength to assess the influence of the process on the rubber-coated parts.
[0019] Such as figure 1 with 2 As shown, a method of the present invention for preparing a fungus-s...
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