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Supporting substrate with inorganic film, glass laminate, method for producing them, and method for producing electronic device

A technology for supporting substrates and manufacturing methods, which is applied in the direction of electronic equipment, electric solid-state devices, semiconductor devices, etc., can solve the problems of reduced handling and insufficient strength of glass substrates, and achieve the effects of suppressing air bubbles and good adhesion

Active Publication Date: 2018-09-25
AGC INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] On the other hand, if the strength of the glass substrate is insufficient due to thinning, the handleability of the glass substrate will decrease in the manufacturing process of electronic devices.

Method used

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  • Supporting substrate with inorganic film, glass laminate, method for producing them, and method for producing electronic device
  • Supporting substrate with inorganic film, glass laminate, method for producing them, and method for producing electronic device
  • Supporting substrate with inorganic film, glass laminate, method for producing them, and method for producing electronic device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0164] A glass plate (AN100 manufactured by Asahi Glass Co., Ltd.) made of alkali-free borosilicate glass having a thickness of 300×300 mm and a thickness of 0.5 mm was prepared as a glass plate to be a supporting substrate.

[0165] While heating the surface of the glass plate to about 580° C., hydrogen fluoride gas was blown to roughen the surface.

[0166] AFM (manufactured by Hitachi High-Technologies Corporation, SPA400) for the surface roughness Ra of the surface of the roughened glass plate, and the difference in peak height between 0% and 10% of the load length ratio of the load curve (hereinafter also referred to as The assay was performed as "Sdc (0-10%)").

[0167] As a result, the surface roughness Ra was 16 nm, and Sdc (0-10%) was 79 nm.

[0168] As a glass substrate, a glass plate (AN100 manufactured by Asahi Glass Co., Ltd.) made of alkali-free borosilicate glass having a thickness of 300×300 mm and a thickness of 0.2 mm was prepared.

[0169] The roughened gl...

Embodiment 2

[0176] As a supporting substrate, a glass plate (AN100 manufactured by Asahi Glass Co., Ltd.) made of alkali-free borosilicate glass having a thickness of 300×300 mm and a thickness of 0.5 mm was prepared.

[0177] On the surface of this supporting substrate, a film of indium tin oxide having a thickness of 450 nm was formed as a flat film by sputtering.

[0178] In the same manner as in Example 1, the surface roughness Ra and Sdc (0-10%) of the surface of the flat film were measured. As a result, the surface roughness Ra was 6.6 nm, and Sdc (0-10%) was 21 nm.

[0179] As a glass substrate, a glass plate (AN100 manufactured by Asahi Glass Co., Ltd.) made of alkali-free borosilicate glass having a thickness of 300×300 mm and a thickness of 0.2 mm was prepared.

[0180] The support substrate on which the flat film was formed and the glass substrate were sufficiently cleaned, and both were laminated by contacting the flat film surfaces, but the support substrate and the glass su...

Embodiment 3

[0186] A glass plate (AN100 manufactured by Asahi Glass Co., Ltd.) made of alkali-free borosilicate glass having a thickness of 300×300 mm and a thickness of 0.5 mm was prepared as a glass plate to be a supporting substrate.

[0187] While heating the surface of the glass plate to about 580° C., hydrogen fluoride gas was blown to roughen the surface to prepare a supporting substrate.

[0188] In the same manner as in Example 1, the surface roughness Ra and Sdc (0-10%) of the surface of the supporting substrate were measured. As a result, the surface roughness Ra was 16 nm, and Sdc (0-10%) was 79 nm.

[0189] As a glass substrate, a glass plate (AN100 manufactured by Asahi Glass Co., Ltd.) made of alkali-free borosilicate glass having a thickness of 300×300 mm and a thickness of 0.2 mm was prepared.

[0190] The support substrate and the glass substrate were sufficiently cleaned, and both were laminated by bringing the roughened surfaces into contact, but the support substrate...

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Abstract

The object of the present invention is to provide a method for suppressing the foaming between the glass substrate (16) and the inorganic film (14) during treatment at high temperature, and furthermore, the adhesion between the inorganic film (14) and the glass substrate (16). Also good support substrate (10) with inorganic membrane. The invention relates to a support substrate (10) with an inorganic film, characterized in that the surface roughness Ra of the surface of the support substrate (10) with an inorganic film on the side of the inorganic film (14) is greater than 2 nm, and the load curve is The difference in peak height between 0% and 10% of the load length ratio is 20 nm or less.

Description

technical field [0001] The present invention relates to a support substrate with an inorganic film used in the manufacture of electronic devices such as liquid crystal panels and organic EL panels using a glass substrate, a glass laminate on which a glass substrate is laminated, their manufacturing methods, and manufacturing of electronic devices method. Background technique [0002] In recent years, electronic devices (electronic devices) such as solar cells (PV), liquid crystal panels (LCD), and organic EL panels (OLED) have been reduced in thickness and weight. Correspondingly, glass substrates used in these electronic devices are being thinned. [0003] On the other hand, if the strength of the glass substrate is insufficient due to thinning, the handleability of the glass substrate will decrease in the manufacturing process of the electronic device. [0004] Therefore, recently, in order to cope with the above-mentioned problems, electronic devices are being manufactu...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B32B9/04B32B7/06B32B17/06C03C17/22C03C17/23H01L51/50H05B33/02
CPCB32B7/06B32B9/04B32B17/06C03C17/22C03C17/23H05B33/02Y02P40/57B32B7/02B32B3/30B32B38/0012B32B2457/00
Inventor 藤原晃男龟田祐人牛光耀岸政洋秋田阳介松山祥孝
Owner AGC INC