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Adhesive composition, adhesive obtained by crosslinking, adhesive for masking film, adhesive for heat-resistant adhesive film, heat-resistant adhesive film for masking, and method of use thereof

A technology for bonding films and adhesives, applied in the direction of film/sheet-like adhesives, adhesive types, ester copolymer adhesives, etc. Damage and other problems, to achieve the effect of not easy to contaminate and good adaptability

Active Publication Date: 2019-06-14
MITSUBISHI CHEM CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Exposure to high temperature in this manufacturing process may cause the adhesive layer of the protective film to adhere to the laminated board, and the ITO transparent electrode layer may be damaged when the protective film is peeled off, or contamination due to adhesive residue may occur
In addition, under high temperature conditions, the adhesive force may be lowered to cause floating, so there is also a problem that it cannot exhibit sufficient protection ability as a protective film.

Method used

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  • Adhesive composition, adhesive obtained by crosslinking, adhesive for masking film, adhesive for heat-resistant adhesive film, heat-resistant adhesive film for masking, and method of use thereof
  • Adhesive composition, adhesive obtained by crosslinking, adhesive for masking film, adhesive for heat-resistant adhesive film, heat-resistant adhesive film for masking, and method of use thereof
  • Adhesive composition, adhesive obtained by crosslinking, adhesive for masking film, adhesive for heat-resistant adhesive film, heat-resistant adhesive film for masking, and method of use thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0161] Hereinafter, although an Example is given and this invention is demonstrated more concretely, this invention is not limited to the following Example unless it deviates from the summary. In addition, "%" and "part" in an example refer to a basis of weight. In addition, the glass transition temperature (Tg) was measured by the method mentioned above.

[0162]

manufacture example 1

[0163] [Manufacturing example 1: Acrylic resin (A-1)]

[0164] Put 119 parts of ethyl acetate, 34.8 parts of acetone and 0.01 part of azobisisobutyronitrile (AIBN) into a reactor equipped with a thermometer, a stirrer, a dropping funnel and a reflux condenser, and heat up while stirring until it reaches 70°C After that, 20 parts of ethoxydiethylene glycol acrylate (manufactured by Kyoeisha Chemical Co., Ltd., trade name "Light acrylate EC-A", number of EO repeating units: 2) (a1) 20 parts, Butyl acrylate (BA) (a2) 73.8 parts, methyl methacrylate (MMA) (a2) 1 part, 2-hydroxyethyl methacrylate (HEMA) (a3) ​​5 parts, dimethylaminopropyl propylene A mixture of 0.2 part of amide (DMAPAA) (a4) and 0.026 part of azobisisobutyronitrile (AIBN). Furthermore, in the middle of the polymerization, while sequentially adding a polymerization catalyst solution in which 0.060 parts of AIBN was dissolved in 2 parts of ethyl acetate, it was polymerized at the above-mentioned temperature under r...

manufacture example 2～20

[0166] Solutions of acrylic resins (A-2) to (A-12), (A'-1) to (A'-8) were prepared in the same manner as in Production Example 1 with the formulation shown in Table 1.

[0167] [Table 1]

[0168]

[0169] ・ECA: Ethoxydiethylene glycol acrylate (manufactured by Kyoeisha Chemical Co., Ltd., trade name "Lightacrylate EC-A", number of EO repeating units: 2)

[0170] 2MTG: Methoxytriethylene glycol acrylate (manufactured by Osaka Organic Chemical Industry Co., Ltd., trade name "Viscoat MTG", number of EO repeating units: 3)

[0171] ・AME400: Methoxypolyethylene glycol acrylate (manufactured by NOF Corporation, brand name "BLEMMERAME400", number of EO repeating units: 9)

[0172] 2MEA: Methoxyethylene glycol acrylate (manufactured by Osaka Organic Chemicals, trade name "2-MTA", number of EO chain repeating units: 1)

[0173] BA: Butyl acrylate

[0174] 2EHA: 2-ethylhexyl acrylate

[0175] MMA: methyl methacrylate

[0176] · HEMA: 2-Hydroxyethyl methacrylate

[0177] AAc: ac...

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Abstract

Provided: Use in heat-resistant adhesive films for masking that can maintain appropriate adhesive strength even under high temperature conditions, and are less likely to cause contamination when peeled off from the adherend after use under high temperature conditions, and can be peeled off with a small force. adhesive composition. An adhesive composition characterized by comprising an acrylic resin (A) having a structural unit derived from a monomer (a1) containing a polyoxyethylene structure, and a source From the structural unit of the alkyl (meth)acrylate monomer (a2), the content of the structural unit derived from the monomer (a1) containing a polyoxyethylene structure is 10 to 45% by weight, and the adhesive The agent composition does not contain an antistatic agent.

Description

technical field [0001] The present invention relates to an adhesive composition, an adhesive obtained by crosslinking it, an adhesive for a masking film, an adhesive for a heat-resistant adhesive film, a heat-resistant adhesive film for masking, and a method for using the same. In other words, it relates to an adhesive composition that can be used in a heat-resistant adhesive film for masking that is less likely to cause contamination when peeled off from an adherend after use under high temperature conditions and can be peeled off with a small force; An adhesive bonded together; an adhesive for a masking film comprising the adhesive; an adhesive for a heat-resistant adhesive film comprising the adhesive; an adhesive comprising the adhesive on a film A heat-resistant adhesive film for masking layers; and, a method of using the heat-resistant adhesive film for masking. Background technique [0002] Flexible printed wiring (FPC) substrates are used in information terminal ele...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J133/14C09J7/30C09J133/06C09J133/26C09J7/20
CPCC09J133/06C09J133/14C09J133/26C09J7/20C09J2203/31
Inventor 竹田俊之
Owner MITSUBISHI CHEM CORP