Normal-temperature cured polyurethane resin composition and preparation method thereof
A polyurethane resin, room temperature curing technology, applied in the field of polyurethane resin, can solve the problems that the resin cannot be used at low temperature, is not suitable for use on site, and the amount of plasticizer added is too large, so as to achieve easy and uniform mixing, simple and reliable preparation process, Easy-to-operate effects
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Embodiment 1
[0032] 80Kg of HTPB with a hydroxyl value of 0.5±0.05mmol / g, 10Kg of rigid foam polyether with a hydroxyl value of 11±0.6mmol / g, 10Kg of PTMG with a hydroxyl value of 3.1±0.05mmol / g, 7Kg of 550 carbon black and 3Kg Put the DOP into a grinder for grinding. After the grinding is completed, put the material into a 200L reactor with a dispersing device, stir, and slowly heat up to 50~55 o C, add 4Kg of calcium sulfate whiskers with an aspect ratio of 75 and 30Kg of 600-mesh silicon micropowder, start the disperser to disperse for 1 hour (keep the material temperature not exceeding 90 during the dispersing process) o C), stop dispersing, heat up to 110~120 o C reduced pressure to 10~20mmHg for dehydration, after dehydration for two hours, lower the temperature to 50 o Below C, add 0.4Kg of BYK-051, 0.5Kg of DISPERBYK-2000, 0.6Kg of BYK-373 and 0.3Kg of N-β(aminoethyl)-γ-aminopropyltrimethoxysilane, 0.4Kg of 264 and 0.1Kg of 168, stirred for 2 hours, discharged, sealed and package...
Embodiment 2
[0036] 550 carbon black and Put 4Kg of DOS into a grinder for grinding. After the grinding is completed, put the material into a 200L reactor with a dispersing device, stir, and slowly heat up to 50~55 o C, add 5Kg of calcium sulfate whiskers with an aspect ratio of 80 and 28Kg of 800-mesh silicon micropowder, start the disperser to disperse for 1 hour (keep the material temperature not exceeding 90 during the dispersion process) o C), stop dispersing, heat up to 110~120 o C reduced pressure to 10~20mmHg for dehydration, after dehydration for two hours, lower the temperature to 50 o Below C, add 0.6Kg of BYK-051, 0.5Kg of DISPERBYK-2000, 0.75Kg of BYK-373 and 0.5Kg of N-β(aminoethyl)-γ-aminopropyltrimethoxysilane, 0.3Kg of 264 and 0.2Kg of 168, stirred for 2 hours, discharged, sealed and packaged as component A.
[0037] Add 95Kg of PAPI and 5Kg of DOP into a 200L reactor, stir at room temperature for 2 hours, discharge, seal and package as component B.
[0038] Fully mix ...
Embodiment 3
[0040] 72Kg of HTPB with a hydroxyl value of 0.7±0.05mmol / g, 8Kg of 12±0.6mmol / g rigid polyether with a hydroxyl value of 12±0.6mmol / g, 20Kg of PTMG with a hydroxyl value of 2±0.05mmol / g, 4Kg of 550 carbon black and 4Kg Put the DOP into a grinder for grinding. After the grinding is completed, put the material into a 200L reactor with a dispersing device, stir, and slowly heat up to 50~55 o C, add 4Kg of calcium sulfate whiskers with an aspect ratio of 85 and 26Kg of 800-mesh silicon micropowder, start the disperser to disperse for 1 hour (keep the material temperature not exceeding 90 during the dispersing process) o C), stop dispersing, heat up to 110~120 o C reduced pressure to 10~20mmHg for dehydration, after dehydration for two hours, lower the temperature to 50 o Below C, add 0.7Kg of BYK-051, 0.3Kg of DISPERBYK-2000, 0.9Kg of BYK-373 and 0.6Kg of N-β(aminoethyl)-γ-aminopropyltrimethoxysilane, 0.2Kg of 264 and 0.3Kg of 168, stirred for 2 hours, discharged, sealed and pa...
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