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Ultraviolet light cured type adhesive and preparation method thereof

A curing type and adhesive technology, applied in the direction of adhesives, polyurea/polyurethane adhesives, modified epoxy resin adhesives, etc., can solve the problem of poor moisture and heat aging resistance, affecting applications, affecting product life, etc. problem, to achieve a fast curing effect

Active Publication Date: 2017-05-10
东莞市贝特利新材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this kind of adhesive generally adopts a one-component epoxy adhesive of thermosetting type, and imidazole or amine adducts are used to absorb water easily, and there is a problem of poor moisture and heat aging resistance, which affects the service life of the product; or use Some polyfunctional epoxy resins with structures such as naphthalene skeleton, biphenyl type, diphenyl type, benzophenone type, and naphthalene ring phenolic type can increase the crosslinking density and TG point of the system, thereby improving the resistance of the system Damp heat performance
However, from the perspective of thermal curing, it needs to be heated above 80°C for several minutes to achieve curing, and the storage and transportation of this type of adhesive require refrigeration, which greatly affects its application.

Method used

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  • Ultraviolet light cured type adhesive and preparation method thereof
  • Ultraviolet light cured type adhesive and preparation method thereof
  • Ultraviolet light cured type adhesive and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] The ultraviolet curing adhesive of the present embodiment includes the following components by weight:

[0036] Urethane acrylate resin:

[0037] Changxing 615-100 15 copies

[0038] CKV-153100 5 copies

[0039] Epoxy acrylate resin:

[0040] Changxing 625C-45 5 copies

[0041] CR-1268 15 copies

[0042] Active monomer:

[0043] Tetrahydrofurfuryl alcohol acrylate 5 parts

[0044] Lauryl Acrylate 10 parts

[0045] N,N Dimethacrylamide 15 parts

[0046] Photoinitiator:

[0047] Photoinitiator 184 3.5 parts

[0048] Photoinitiator 907 0.5 parts

[0049] filler:

[0050] Talc powder 2 parts

[0051] Fumed silica 4 parts

[0052] Coupling agent:

[0053] KH-570 0.5 parts

[0054] The preparation method of the above-mentioned ultraviolet light-curable adhesive comprises the following steps:

[0055] a) take each component raw material by weighing according to above-mentioned formula;

[0056] b) Add polyurethane acrylic resin, epoxy acrylate resin, tetrahydrof...

Embodiment 2

[0059] The ultraviolet curing adhesive of the present embodiment includes the following components by weight:

[0060] Urethane acrylate resin:

[0061] B-221 10 copies

[0062] UV-3026 15 parts

[0063] Epoxy acrylate resin:

[0064] HS-9001 25 copies

[0065] Active monomer:

[0066] 5 parts methyl methacrylate

[0067] 10 parts of isooctyl acrylate

[0068] Nitrogenylpyrrolidone 20 parts

[0069] Photoinitiator:

[0070] Photoinitiator 184 3 parts

[0071] 3 parts benzophenone

[0072] filler:

[0073] Nano calcium carbonate 3 parts

[0074] Fumed silica 4.5 parts

[0075] Bentonite 0.5 parts

[0076] Coupling agent:

[0077] KH-792 0.8 parts

[0078] The preparation method of the above-mentioned ultraviolet light-curable adhesive comprises the following steps:

[0079] a) take each component raw material by weighing according to above-mentioned formula;

[0080] b) Add the polyurethane acrylic resin, epoxy acrylate resin, active monomer and coupling agent ...

Embodiment 3

[0083] The ultraviolet curing adhesive of the present embodiment includes the following components by weight:

[0084] Urethane acrylate resin:

[0085] LM-6200 14 copies

[0086] CKV-153100 16 copies

[0087] Epoxy acrylate resin:

[0088] Heinz 5327 30 parts

[0089] Active monomer:

[0090] 20 parts of isobornyl acrylate

[0091] 5 parts of hydroxypropyl acrylate

[0092] Hydroxyethyl methacrylate 15 parts

[0093] Photoinitiator:

[0094] Photoinitiator 651 3.5 parts

[0095] TPO 3.5 parts

[0096] filler:

[0097] Silica powder 4 parts

[0098] Fumed silica 6 parts

[0099] Coupling agent:

[0100] KH-560 1 part

[0101] The preparation method of above-mentioned ultraviolet curing type adhesive is characterized in that: comprise the following steps:

[0102] a) take each component raw material by weighing according to above-mentioned formula;

[0103] b) Add the above-mentioned polyurethane acrylic resin, epoxy acrylate resin, active monomer and coupling a...

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PUM

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Abstract

The invention relates to an ultraviolet light cured type adhesive which contains the following components in parts by weight: 20-30 parts of urethane acrylate resin, 20-30 parts of epoxy acrylic resin, 30-40 parts of an active monomer, 5-10 parts of a filler, 4-7 parts of a photoinitiator, and 0.5-1 part of a coupling agent. The preparation method of the ultraviolet light cured type adhesive comprises the following steps: a) weighing the raw material of each ingredient according to a formula as described in Claim 1 or 2; b) successively adding the urethane acrylate resin, the epoxy acrylic resin, the active monomer and the coupling agent into a reaction kettle, stirring the mixture evenly for 0.5-1.5h at normal temperature, adding the filler and the photoinitiator therein, cooling the mixture to 24-26 DEG C after uniform dispersion, and then discharging the materials; and c) making the materials, obtained in step b), subjected to centrifugal foam scrubbing, so as to obtain the ultraviolet light cured type adhesive. The preparation procedure in the preparation method of the ultraviolet light cured type adhesive is simple and easy, and the obtained product has excellent performance and is convenient for storage, transportation and fast solidification.

Description

technical field [0001] The invention relates to the technical field of chemical material adhesives, in particular to an ultraviolet light-curable adhesive used for bonding LENS of LED backlight modules and a preparation method thereof. Background technique [0002] In the process of producing light sources such as LCD backlights and LED light sources, a fast-curing adhesive is needed to bond LENS (lenses) made of polymethyl methacrylate and polycarbonate to PCB boards. In recent years, the amount of this adhesive has increased rapidly. However, this kind of adhesive generally adopts a one-component epoxy adhesive of thermosetting type, and imidazole or amine adducts are used to absorb water easily, and there is a problem of poor moisture and heat aging resistance, which affects the service life of the product; or use Some polyfunctional epoxy resins with structures such as naphthalene skeleton, biphenyl type, diphenyl type, benzophenone type, and naphthalene ring phenolic t...

Claims

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Application Information

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IPC IPC(8): C09J175/14C09J163/10
CPCC09J163/10C09J175/14C08L63/10C08L75/14
Inventor 周传玉谢梓华鲍有雨
Owner 东莞市贝特利新材料有限公司