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Computer top mounted flow guiding cooler

A computer and heat sink technology, which is applied in the field of computer top-mounted diversion radiators, can solve the problems of air flow overflow and insufficient efficiency, and achieve the effects of less air flow, improved heat dissipation effect, and high heat dissipation efficiency

Inactive Publication Date: 2017-05-10
重庆优之唯电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] With the development of the economy and the progress of science and technology, the computer has become an indispensable tool for our life and production. Some people spend a long time with the computer every day. However, the computer is a kind of radiation machine, especially the computer case. It is the main radiation source. In order to reduce the radiation of the chassis, the applicant submitted the application number 2016212360708 on November 18, 2016, entitled "A Conduit Type Forced Convection Bottom-Drain Computer Chassis", which can effectively solve the electromagnetic radiation of the computer chassis , the application adopts bottom air inlet and outlet, the inlet air and outlet air are respectively introduced and exhausted through the duct, the air inlet duct points to the components that need heat dissipation, and provides convective air for cooling, but the airflow in the air inlet duct cannot be fully applied to the parts that need to be dissipated. Part, or only applied to a part of a heat dissipation component, and there is a phenomenon of airflow overflow at the same time, and the efficiency of using the imported airflow to dissipate heat is not sufficient, which still needs to be further solved and improved

Method used

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  • Computer top mounted flow guiding cooler
  • Computer top mounted flow guiding cooler

Examples

Experimental program
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Embodiment Construction

[0012] Examples of the present invention figure 1 , 2 As shown, the top-mounted flow-guiding radiator of the computer is provided with a heat sink and an air guide joint, and the heat sink is provided with a heat dissipation bottom plate 1, and the front of the heat dissipation bottom plate is in contact with the heating components, and the connection method can be screw connection or buckle connection. Parallel longitudinal side plates 2 are respectively connected to both sides of the back of the base plate, and a longitudinal wing plate 3 of the same height as the longitudinal side plate is connected between the two longitudinal side plates on the back of the heat dissipation base plate, and a bayonet 9 is provided in the middle of the longitudinal side plate; The air guide joint is provided with a left and right strip-shaped air outlet channel 4 and a right strip-shaped air outlet channel 5, which are symmetrically distributed across the top and stop at the middle of the ou...

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PUM

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Abstract

The invention discloses a computer top mounted flow guiding cooler. The cooler is characterized in that an air flow guide connector is provided with a left strip air outlet flow channel and a right strip air outlet flow channel which are arranged in parallel. The left strip air outlet flow channel and the right strip air outlet flow channel cross and push the middle section of the outer rims of longitudinal wing plates. The left strip air outlet flow channel and the right strip air outlet flow channel forms an angle of 30-120 degrees. The upper end of the left strip air outlet channel and the upper end of the right strip air outlet channel converge together and are connected with an air inlet flow channel. The air inlet flow channel is connected with an air inlet. From the air inlet side to the side of the strip air outlet flow channel, the air inlet flow channel becomes narrower gradually. Two ends of the left strip air outlet flow channel, two ends of the right strip air outlet flow channel and two ends of the air inlet flow channel are all provided with sealing end plates. The sealing end plates extend out of a connecting end plate attached to the middle side of the longitudinal side plate. The connecting end plate is buckled through a buckling hook. The air flow passes through the cooling fins in a more concentrated manner, and the cooling efficiency is higher.

Description

technical field [0001] The invention relates to a heat sink for components inside a computer case, in particular to a top-mounted flow guide type heat sink for a computer. Background technique [0002] With the development of the economy and the progress of science and technology, the computer has become an indispensable tool for our life and production. Some people spend a long time with the computer every day. However, the computer is a kind of radiation machine, especially the computer case. It is the main radiation source. In order to reduce the radiation of the chassis, the applicant submitted the application number 2016212360708 on November 18, 2016, entitled "A Conduit Type Forced Convection Bottom-Drain Computer Chassis", which can effectively solve the electromagnetic radiation of the computer chassis , the application adopts bottom air inlet and outlet, the inlet air and outlet air are respectively introduced and exhausted through the duct, the air inlet duct point...

Claims

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Application Information

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IPC IPC(8): G06F1/20
CPCG06F1/20
Inventor 王华生
Owner 重庆优之唯电子科技有限公司
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