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Capacitive sensor architecture for biometric sensing

A capacitive and sensor technology, applied in subcutaneous biometrics, biometrics recognition, instruments, etc., can solve problems such as low signal quality

Active Publication Date: 2017-05-10
SYNAPTICS INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, capacitively sensing fingerprint signatures and other fine features is a challenging task
Although existing sensors are able to provide adequate performance, they often suffer from low signal quality

Method used

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  • Capacitive sensor architecture for biometric sensing
  • Capacitive sensor architecture for biometric sensing
  • Capacitive sensor architecture for biometric sensing

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Embodiment Construction

[0022] The following detailed description is merely exemplary in nature and is not intended to limit the disclosure or the application and uses of the disclosure. Furthermore, there is no intention to be bound by any expressed or implied theory presented in the preceding technical field, background, brief description, or the following detailed description.

[0023] Various embodiments of the present disclosure provide input devices and methods that facilitate improved usability. In some capacitive sensor constructions, the receiver electrode layer is stacked above (or below) the transmitter electrode layer with an insulating layer in between. When an input, such as a finger, is provided to the capacitive sensor, a change in the electromagnetic field between the transmitter and receiver electrode layers is detected. However, since the transmitter and receiver electrodes are on different layers, the system can suffer from low image quality because the difference in electromagne...

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Abstract

A capacitive sensor architecture for biometric sensing is disclosed. A capacitive sensor and a method of making a capacitive sensor are disclosed. The capacitive sensor includes: a plurality of rows of sensor electrodes included in a first layer; a plurality of columns of sensor electrodes included in a second layer, where the plurality of columns of sensor electrodes are arranged orthogonally to the plurality of rows of sensor electrodes to form a two-dimensional sensing array; and, a plurality of conductive elements included in a third layer disposed between the first and second layers, wherein, for each conductive element of the plurality of conductive elements, a first end of the conductive element is electrically connected to a sensor electrode in the plurality of rows of sensor electrodes and a second end of the conductive element is capacitively coupled to a sensor electrode in the plurality of columns of sensor electrodes to form a trans-capacitive sensing pixel of the two-dimensional sensing array.

Description

[0001] Cross References to Related Applications [0002] This application claims priority to US Provisional Patent Application No. 62 / 211,632, filed August 28, 2015, which is hereby incorporated by reference in its entirety. technical field [0003] The present disclosure relates generally to capacitive sensors and, more specifically, to fingerprint sensor arrays utilizing mutual capacitance sensing principles. Background technique [0004] Input devices including proximity sensor devices (also commonly referred to as touch pads or touch sensor devices) are widely used in various electronic systems. Input devices also include fingerprint sensors and other biometric sensor devices. A sensor device typically includes a sensing region, typically distinguished by a surface, in which the sensor device determines the presence, position, motion, and / or characteristics of one or more input objects. The sensor device can be used to provide an interface to the electronic system. Fo...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06K9/00G06K9/20
CPCG06V40/1306G06V40/10G06V40/14G06V10/147
Inventor S.温
Owner SYNAPTICS INC