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Method for producing conductive coating film, and conductive coating film

A manufacturing method and conductivity technology, applied in the direction of conductive materials dispersed in non-conductive inorganic materials, conductive coatings, equipment for manufacturing conductive/semiconductive layers, etc., can solve insufficient sintering effects, changes in characteristics, and conductivity Problems such as deterioration, to achieve excellent adhesion, prevent the reduction of adhesion force, and improve the effect of adhesion

Inactive Publication Date: 2017-05-10
TODA IND
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] However, in the treatment of the copper surface using heterocyclic compounds or hydrazide compounds, the sintering effect of heating is insufficient, the performance of electrical conductivity is deteriorated, or there are problems such as changes in characteristics due to cleaning of the treated layer.
In addition, when the coating film is obtained from a conductive paste containing copper powder, the conductive layer cannot be treated in advance like copper foil.

Method used

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  • Method for producing conductive coating film, and conductive coating film
  • Method for producing conductive coating film, and conductive coating film
  • Method for producing conductive coating film, and conductive coating film

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0100] The composition with the following mixing ratio was put into a sand mill and dispersed at 800 rpm for 1 hour. As the media, zirconia beads with a radius of 0.2 mm were used. Apply the obtained copper paste on the resin layer of the polyimide film (AC-1) with a resin layer using a coater so that the thickness after drying becomes 2 μm, and perform hot air at 100°C for 5 minutes After drying, a coating film containing copper powder was obtained.

[0101] Dispersion composition

[0102]

[0103] The obtained coating film containing copper powder was subjected to superheated steam treatment at 330° C. for 2 minutes. A steam heating device ("DHF Super-Hi10" manufactured by Daiichi High Frequency Industry Co., Ltd.) was used as a generator of superheated steam, and 10 kg / hour of superheated steam was supplied to the heat treatment furnace. Table 3 shows the evaluation results of the obtained conductive coating film.

Embodiment 2～8

[0105] Except having used the polyimide film with the resin layer described in Table 3 as an insulating board|substrate, it carried out similarly to Example 1, and obtained the electroconductive coating film. Table 3 shows the evaluation results of the obtained conductive coating film.

Embodiment 9～14

[0107]The composition with the following mixing ratio was put into a sand mill and dispersed at 800 rpm for 1 hour. As the media, zirconia beads with a radius of 0.2 mm were used. Apply the obtained copper paste on the resin layer of the polyimide film (AC-9) with a resin layer using a coater so that the thickness after drying becomes 2 μm, and perform hot air at 100°C for 5 minutes After drying, a coating film containing copper powder was obtained.

[0108] Dispersion composition

[0109]

[0110] The obtained coating film containing copper powder was subjected to superheated steam treatment at 300° C. for 2 minutes. A steam heating device ("DHF Super-Hi10" manufactured by Daiichi High Frequency Industry Co., Ltd.) was used as a generator of superheated steam, and 10 kg / hour of superheated steam was supplied to the heat treatment furnace. Table 3 shows the evaluation results of the obtained conductive coating film. However, in Examples 10 to 14, the polyimide film with...

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Abstract

The invention discloses a method for producing a conductive coating film, and a conductive coating film. The purpose of the present invention is to provide a conductive coating film which is provided on an insulating substrate using a copper paste and which exhibits not only excellent electrical conductivity but also improved adhesion to the insulating substrate. The conductive coating film according to the present invention is produced by: arranging, on an insulating substrate, a resin layer that contains a heterocyclic compound containing nitrogen in a heterocyclic ring and / or a hydrazide compound; forming a copper powder-containing coating film on the resin layer using a copper paste; and subsequently subjecting the coating film to a heat treatment in a non-oxidizing gas atmosphere.

Description

technical field [0001] The present invention relates to a method for producing a conductive coating film excellent in adhesion to an insulating substrate and conductivity, and a conductive coating film obtained by the production method. Background technique [0002] In recent years, conductive circuits have rapidly been densified. At present, the metal surface etching (substractive) method of etching and patterning a copper foil adhered to an insulating substrate for forming a conductive circuit has a long and complicated process and generates a large amount of waste. Therefore, attention has been drawn to a printing method and a coating method using a conductive paste containing conductive particles for forming a conductive circuit instead of the metal surface etching method. [0003] Silver is generally used as the metal used for the conductive particles from the viewpoint of conductivity and stability over time. However, silver is not only expensive but also has a small...

Claims

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Application Information

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IPC IPC(8): H01B13/00B05D3/02B05D5/12B05D7/24B32B7/02C09D5/00C09D5/24C09D7/12C09D201/00H01B1/22H01B5/14
CPCB05D5/12B05D7/24B05D3/02C09D5/00C09D5/24C09D201/00H01B1/22H01B5/14H01B13/00C09D7/40C09D7/61H01B13/0016H01B13/0026
Inventor 八塚刚志伊藤千穗
Owner TODA IND
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