A surface processing method suitable for diamond/copper composite materials

Abstract

The invention discloses a surface machining method applicable to a diamond / copper composite material, and belongs to the field of surface treatment technologies for composite materials. The surface machining method comprises the steps that a ceramic bond diamond grinding wheel is adopted for conducting primary coarse grinding, so that excess copper on the surface of the diamond / copper composite material is removed; a fine-particle diamond ceramic bond diamond grinding wheel is adopted for conducting secondary coarse grinding, and the surface roughness is made smaller than 2 micrometers; and a high-hardness diamond grinding wheel is adopted for conducting accurate grinding when the size is 0.03-0.08 mm greater than the target size, and finally the surface roughness is smaller than 1 micrometers. According to the surface machining method, flat grinding through the grinding wheels is conducted during coarse grinding and accurate grinding, the grinding efficiency is high, the cost is low, machining is convenient, batch production can be achieved, and the surface smoothness of the composite material is guaranteed; and above all, other impurities are not introduced in the machining process, and the clad layer reliability is improved after the surface of the composite materials is cladded.

Description

technical field [0001] The invention belongs to the technical field of surface treatment of composite materials, and in particular relates to a method for surface processing of diamond / copper composite materials. Background technique [0002] Due to its excellent comprehensive properties such as high thermal conductivity, low expansion and adjustable physical properties, diamond / copper composite materials have become important candidate materials for heat dissipation of electronic packaging devices such as semiconductor lasers and microwave power electronics, and are used to replace existing tungsten copper , molybdenum copper and other electronic packaging materials. Diamond / copper composite materials have excellent heat dissipation performance, and are widely used in electronic components such as electronic packaging and thermal control components, and are widely used in my country's electronics, aerospace, weapons, semiconductor lasers and other industries. There is a ZL...

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Problems solved by technology

There is a ZL200710178844.5 high thermal conductivity copper-based composite material and its preparation method, and the diamond / copper composite material has been successfully prepared. However, due to the diamond particles contained in the diamond / copper composite material, it is difficult to process conventional silicon carbide grinding wheels and alumina grinding wheels to achieve electronic The requirement that the surface roughness of the device is less than 1 micron

Using the method of diamond micropowder grinding, adding diamond micropowder to the grinding disc can obtain a surface with a roughness less than 1 micron, but there are two problems. One is that the grinding efficiency is low, and it is difficult to apply in large quantities; The metal impurities in the diamond-copper composite material are easily embedded in the copper matrix of the diamond-copper composite material, causing the surface color of the material to become black, and the introduction of impurities is detrimental to the plating reliability of the later material

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