A photosensitive resin composition, a manufacturing method thereof, a light-shielding film, a manufacturing method of the light-shielding film, a liquid crystal display and a manufacturing method of the liquid crystal display
A technology of liquid crystal display device and photosensitive resin, applied in the fields of photosensitive resin composition and light-shielding film, can solve the problems of influence of TFT electrical characteristics, deterioration of display quality, etc., and achieve the effect of excellent elastic recovery rate
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[0107] Hereinafter, embodiments of the present invention will be specifically described based on Examples and Comparative Examples, but the present invention is not limited thereto.
[0108] First, the synthesis example of (A) polymerizable unsaturated group containing alkali-soluble resin of this invention is shown. The evaluation of the resin in the synthesis example was performed as follows.
[0109] [Solid content concentration]
[0110] 1 g of the resin solution obtained in the synthesis example was impregnated in a glass filter [weight: W 0 (g)], weighing [W 1 (g)], according to the weight after heating at 160°C for 2 hours [W 2 (g)], obtained by the following formula.
[0111] Solid content concentration (weight%)=100×(W 2 -W 0 ) / (W 1 -W 0 )
[0112] [acid value]
[0113] The resin solution was dissolved in dioxane, and it was determined by titrating with a 1 / 10 N-KOH aqueous solution using a potentiometric titration device [manufactured by Hiranuma Sangyo Co....
Synthetic example 1
[0119] In a 500mL four-necked flask with a reflux cooler, add 105.7g (0.29mol) of bisphenol A type epoxy compound (manufactured by Nichika Epoxy Manufacturing Co., trade name YD-128, epoxy equivalent=182 ), 41.8g (0.58mol) of acrylic acid, 1.52g of triphenylphosphine (triphenylphosphine, TPP), and 40.0g of propylene glycol monomethyl ether acetate (PGMEA), stirred at 100°C to 105°C for 12hr , to obtain the reaction product.
[0120] Then, 16.9 g (0.13 mol) of dimethylolpropionic acid and 96 g of PGMEA were added to the obtained reaction product, and it heated up to 45 degreeC. Then, 61.8 g (0.28 mol) of isophorone diisocyanate was dripped, paying attention to the temperature in a flask. After completion of the dropwise addition, the mixture was stirred under heating at 75° C. to 80° C. for 6 hr. Furthermore, 6.2 g (0.04 mol) of tetrahydrophthalic anhydride was added, and it stirred under heating at 90-95 degreeC for 6 hr, and obtained the alkali-soluble resin solution (A)-1 ...
Synthetic example 2
[0122] In a 500mL four-necked flask with a reflux cooler, add 104.2g (0.29mol) of bisphenol A type epoxy compound (manufactured by Nippon Steel Sumitomo Metal Chemical Co., Ltd., trade name YD-128, epoxy equivalent = 182), 41.2g (0.57mol) of acrylic acid, 1.50g of TPP, and 40.0g of PGMEA were stirred under heating at 100°C to 105°C for 12hr to obtain a reaction product.
[0123] Then, 23.1 g (0.17 mol) of dimethylolpropionic acid and 98 g of PGMEA were added to the obtained reaction product, and it heated up to 45 degreeC. Then, 68.0 g (0.31 mol) of isophorone diisocyanate was dripped, paying attention to the temperature in the flask. After completion of the dropwise addition, it was stirred under heating at 75° C. to 80° C. for 6 hrs to obtain a polymerizable unsaturated group-containing alkali-soluble resin solution (A)-2. The solid content concentration of the obtained resin solution was 63.3 wt%, the acid value (solid content conversion) was 41 mgKOH / g, and the Mw obtaine...
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