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P-type CuMSnO amorphous oxide semiconductor thin film and preparation method of p-type CuMSnO amorphous oxide semiconductor thin film

A technology of amorphous oxide and semiconductor, applied in semiconductor/solid-state device manufacturing, semiconductor devices, transistors, etc., to achieve good performance, good material characteristics, and promote development

Active Publication Date: 2017-05-24
ZHEJIANG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the currently reported AOS TFTs are all n-type channel, lack of p-type channel AOS TFT, which greatly restricts the application of AOS TFT in new generation display, transparent electronics and many other fields.

Method used

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  • P-type CuMSnO amorphous oxide semiconductor thin film and preparation method of p-type CuMSnO amorphous oxide semiconductor thin film
  • P-type CuMSnO amorphous oxide semiconductor thin film and preparation method of p-type CuMSnO amorphous oxide semiconductor thin film
  • P-type CuMSnO amorphous oxide semiconductor thin film and preparation method of p-type CuMSnO amorphous oxide semiconductor thin film

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Experimental program
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Effect test

Embodiment 1

[0029] (1) with high-purity Cu 2 O, Al 2 o 3 and SnO powder as raw materials, mixed, ground, and sintered in an Ar atmosphere at 950°C to make CuAlSnO ceramic sheets as targets, in which the atomic ratio of Cu, Al, and Sn is 1:0.5:2;

[0030] (2) Using the pulsed laser deposition (PLD) method, the substrate and target were installed in the PLD reaction chamber, and the vacuum was evacuated to 9×10 -4 Pa;

[0031] (3) Pass into O 2 As the working gas, the gas pressure is 13Pa, the substrate temperature is room temperature, the target is bombarded with pulsed laser, the atoms and molecules on the surface of the target are melted and deposited on the substrate to form a thin film, and p-type CuAl is obtained. 0.5 sn 2 o 3.25 Amorphous thin film.

[0032] Using quartz as the substrate, p-type CuAl was prepared according to the above growth steps 0.5 sn 2 o 3.25 The film was tested for its structure, electrical and optical properties. The test results are: the film is amo...

Embodiment 2

[0035] (1) with high-purity Cu 2 O, Al 2 o 3 and SnO powder as raw materials, mixed, ground, and sintered in an Ar atmosphere at 1000°C to make CuAlSnO ceramic sheets as targets, in which the atomic ratio of Cu, Al, and Sn is 1:1:1;

[0036] (2) Using the pulsed laser deposition (PLD) method, the substrate and target were installed in the PLD reaction chamber, and the vacuum was evacuated to 9×10 -4 Pa;

[0037] (3) Pass into O 2 As the working gas, the gas pressure is 11Pa, the substrate temperature is room temperature, the target is bombarded with pulsed laser, the atoms and molecules on the surface of the target are melted and deposited on the substrate to form a thin film, and p-type CuAlSnO is obtained. 2 Amorphous thin film.

[0038] Using quartz as the substrate, p-type CuAlSnO was prepared according to the above growth steps 2 The film was tested for its structure, electrical and optical properties. The test results are: the film is amorphous, with a thickness of...

Embodiment 3

[0041] (1) with high-purity Cu 2 O, Al 2 o 3 and SnO powder as raw materials, mixed, ground, and sintered in an Ar atmosphere at 1050°C to make CuAlSnO ceramic sheets as targets, in which the atomic ratio of Cu, Al, and Sn is 1:1.5:2;

[0042] (2) Using the pulsed laser deposition (PLD) method, the substrate and target were installed in the PLD reaction chamber, and the vacuum was evacuated to 9×10 -4 Pa;

[0043] (3) Pass into O 2 As the working gas, the gas pressure is 9Pa, the substrate temperature is room temperature, the target is bombarded with pulsed laser, the atoms and molecules on the surface of the target are melted and deposited on the substrate to form a thin film, and p-type CuAl is obtained. 1.5 sn 2 o 4.75 Amorphous thin film.

[0044] Using quartz as the substrate, p-type CuAl was prepared according to the above growth steps 1.5 sn 2 o 4.75 The film was tested for its structure, electrical and optical properties. The test results are: the film is amo...

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Abstract

The invention discloses a p-type CuMSnO amorphous oxide semiconductor thin film. M is selected from group-III elements B, Al, Ga, In, Sc and Y. Cu and Sn are commonly used as basic elements of a material; the Cu has a <+1> valence and the Sn has a <+2> valence, and the Cu and the Sn are combined with O to form a p-type conducting property of the material; the M has a <+3> valence, has a relatively low standard electrode potential and has high combining energy with the O; the M is used as a control element of hole concentration; meanwhile, the Sn has a spherical electron orbit and electron clouds can be greatly overlapped under an amorphous state, so that the Sn also has the effect of a hole transportation channel. The invention further discloses a preparation method of the p-type CuMSnO amorphous oxide semiconductor thin film and application of the p-type CuMSnO amorphous oxide semiconductor thin film to thin film transistors. The prepared thin film has the hole concentration of 10<14>cm<-3> to 10<15>cm<-3> and the visible light transmittance is more than or equal to 80 percent. A p-type CuAlSnO amorphous thin film is a channel layer; a TFT (Thin Film Transistor) prepared by the p-type CuAlSnO amorphous thin film has the on / off current ratio of (1 to 9)*10<4> and the field-effect mobility of 0.4cm<2> / Vs to 5cm<2> / Vs.

Description

technical field [0001] The invention relates to an amorphous oxide semiconductor thin film, in particular to a p-type amorphous oxide semiconductor thin film and a preparation method thereof. Background technique [0002] Thin film transistor (TFT) is one of the core technologies in the field of microelectronics, especially display engineering. At present, TFT is mainly based on amorphous silicon (a-Si) technology, but a-Si TFT is opaque, has strong photosensitivity, and needs to add a mask layer. The pixel aperture ratio of the display screen is low, which limits the display performance. And the mobility of a-Si is low (~2 cm 2 / Vs), cannot meet some application requirements. Although TFT based on polysilicon (p-Si) technology has high mobility, its device uniformity is poor and its fabrication cost is high, which limits its application. In addition, organic semiconductor thin-film transistors (OTFT) have also been studied a lot, but the stability of OTFT is not high, an...

Claims

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Application Information

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IPC IPC(8): H01L29/10H01L29/24H01L29/786H01L21/203
Inventor 吕建国于根源黄靖云叶志镇
Owner ZHEJIANG UNIV