A kind of epoxy resin heat conducting composite material and its preparation and application

Abstract

The invention discloses epoxy resin-based thermal conductive composite material as well as preparation and application thereof. The epoxy resin-based thermal conductive composite material is that 5-20 percent by weight of inorganic filler is dispersed in epoxy resin; the inorganic filler comprises a two-dimensional lamellar inorganic filler and a spherical inorganic filler. Compared with the prior art, the epoxy resin-based thermal conductive composite material disclosed by the invention has the benefits that through improving a key thermal conductive filler structure in the epoxy resin-based thermal conductive composite material as well as the adding amount and the like, and by adopting a corresponding preparation method, the problems of poor thermal conductivity, high viscosity and the like of the epoxy resin-based thermal conductive composite material can be effectively solved; through the composite addition of different types and morphologies of the thermal conductive fillers, the epoxy resin-based thermal conductive composite material with high thermal conductivity and low viscosity is prepared and is particularly applicable to being used as an electronic packaging material.

Description

technical field [0001] The invention belongs to the field of thermal interface materials, and more specifically relates to an epoxy resin heat-conducting composite material and its preparation and application. Background technique [0002] Nowadays, the use of electronic products is becoming more and more common, and it is also developing in the direction of miniaturization. Its application will generate a lot of heat, and the increase in the temperature of electronic devices will have a great impact on life, efficiency and energy consumption. Therefore, improving the heat dissipation capacity has become a research hotspot. Thermally conductive and insulating packaging materials with high heat dissipation performance are the key links to improve the working stability and service life of electronic components. Plastic packaging is widely used in the field of thermal interface materials and electronic packaging due to its excellent electrical insulation performance, processin...

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Problems solved by technology

[0005] In view of the above defects or improvement needs of the prior art, the object of the present invention is to provide an epoxy resin thermally conductive composite material and its preparation and application, wherein through the key thermally conductive filler structure in the epoxy resin thermally conductive composite material, and adding Compared with the existing technology, it can effectively solve the problems of poor thermal conductivity and high viscosity of epoxy resin composite materials. By compounding and adding different types and shapes of thermal conductive fillers, the preparation of both An epoxy resin-based thermally conductive composite material with low viscosity and high thermal conductivity; the amount of inorganic filler added in the epoxy resin thermally conductive composite material is as low as 5% to 20% by volume, while the thermal conductivity is not lower than 0.91W / m K, its viscosity is less than 20Pa s at 30°C, good thermal conductivity and low viscosity, which ensure the good mechanical properties and processing properties of the composite material, especially suitable for electronic packaging materials

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