Working shaft assembly for equipment special for semiconductor

Abstract

The invention provides a working shaft assembly for equipment special for a semiconductor. The working shaft assembly comprises a shaft sleeve seat, a shaft sleeve and a working shaft. The shaft sleeve comprises a shaft sleeve part fixedly connected with the shaft sleeve seat and an annular fixing part connected with the shaft sleeve part and the working shaft, wherein the working shaft is located in the shaft sleeve part, and the annular fixing part is provided with a plurality of through holes. A first flange boss, a second flange boss and a third flange boss are arranged at preset positions of the side wall of the working shaft. A first differential screw mechanism is arranged in the first flange boss. A second differential screw mechanism is arranged in the second flange boss. An auxiliary locating structure is arranged in the third flange boss. According to the working shaft assembly, based on the differential screw transmission principle, the working shaft generates a slight angle change in the preset direction, the angle change directly acts on the working shaft, and the angle adjusting efficiency and precision can be improved; and meanwhile, the stability, reliability and working efficiency of the equipment special for the semiconductor are improved, operation is simple, and wide applicability is achieved.

Description

technical field [0001] The invention relates to the technical field of semiconductor processing, in particular to a working shaft assembly for semiconductor special equipment. Background technique [0002] In the process of semiconductor special equipment manufacturing and development, in order to meet the process development and application requirements of advanced packaging, semiconductor materials need to be thinned, polished, cleaned and other processes, and the main technical indicators have reached the advanced level of international similar equipment. In this case, partial transcendence is required. At the same time, the localization of equipment will greatly reduce the various costs of equipment, so as to generate good technical and economic benefits, and better support the development of advanced packaging technology and industry in my country's semiconductor industry. Therefore, the key to reducing costs is to seek common technology research and development in var...

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a working shaft assembly for semiconductor special equipment, which is used to solve the problem in the prior art that it is difficult to realize multi-angle fine-tuning of the working shaft before the production and processing of semiconductors

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