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A kind of dual camera assembly method

An assembly method and dual-camera technology, applied in installation, image communication, instruments, etc., can solve the problems of high cost, high defective rate, and difficult chip installation, and achieve the effect of low production cost and high accuracy

Active Publication Date: 2019-01-22
深圳市合力泰光电有限公司
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AI Technical Summary

Problems solved by technology

Because the installation of dual-camera chips on a common substrate is difficult and has a high defect rate, the existing technology generally uses dual-cameras on a common bracket, but because most manufacturers in the prior art only have single-camera assembly equipment, they can only perform single-camera Assembly, if you want to assemble a dual camera with a common bracket, you need to re-purchase the dual camera assembly equipment, assemble the two single cameras and adjust the optical axes of the two single cameras, which is more expensive

Method used

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  • A kind of dual camera assembly method
  • A kind of dual camera assembly method
  • A kind of dual camera assembly method

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Embodiment Construction

[0017] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments, but the present invention is not limited to the following specific embodiments.

[0018] The dual camera module of the present application includes a bracket 1 and two single camera modules 2 arranged on the bracket 1. The single camera module 2 includes a PCB board 3, a chip 4 arranged on the PCB board 3 and a chip 4 arranged on the PCB board. The lens assembly 5 on the board 3, the PCB board 3 is provided with three marking points 6, and the three marking points 6 can determine a circle center point, and a two-dimensional code 7 is also provided on the camera module.

[0019] A method for assembling a dual camera, comprising the following steps:

[0020] (1) Set three marking points on the PCB, and then get a center point based on these three marking points; the connecting line connected by these three marking points is parallel to the edge of ...

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Abstract

The present invention relates to the technical field of dual cameras, in particular to a method for assembling a dual camera. The actual optical axis offset angle is obtained through the center point of the circle, the center point of the chip, and the center point of the light spot, and then two images with similar actual optical axis offset angles are selected. Single camera components are combined to obtain a dual camera component, which is less costly and the resulting dual camera component is more accurate.

Description

technical field [0001] The present invention relates to the technical field of dual cameras, in particular to a dual camera assembly method. Background technique [0002] The assembly structure of the dual camera is generally divided into two types, one is the common substrate, and two chips are installed on the same PCB; the other is the common bracket, and the two independent single camera modules are fixed by the bracket. Because the installation of dual-camera chips on a common substrate is difficult and has a high defect rate, the existing technology generally uses dual-cameras on a common bracket, but because most manufacturers in the prior art only have single-camera assembly equipment, they can only perform single-camera Assembly, if you want to assemble a dual camera with a common bracket, you need to buy a new dual camera assembly equipment to assemble the two single cameras and adjust the optical axes of the two single cameras, which is costly. Contents of the i...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G02B7/00H04N5/225
CPCG02B7/00H04N23/50
Inventor 徐宇震陈明
Owner 深圳市合力泰光电有限公司
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