Optical device, exposure device with optical device, and article manufacturing method
A technology of optical equipment and optical components, which can be applied in the direction of photolithography process exposure device, optomechanical equipment, microlithography exposure equipment, etc., and can solve the problems of increasing the size of the cooling unit and increasing the cost.
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no. 1 example
[0016] figure 1 is a schematic diagram illustrating the configuration of an exposure apparatus to which the optical apparatus according to the first embodiment of the present invention is applied. The exposure apparatus 50 includes an illumination optical system IL, a projection optical system PO, a mask stage MS that holds a mask 55 movably, a substrate stage WS that holds a substrate 56 movably, and a controller 51 . In drawings to be described below, a Z axis is defined in an up-down direction (vertical direction), and an X axis and a Y axis perpendicular to each other are defined in a plane perpendicular to the Z axis. The illumination optical system IL includes a light source and a slit (both of which are not shown). The illumination optical system IL shapes the light emitted from the light source into, for example, an arc shape long in the XY direction, and irradiates the mask 55 with slit light. The mask stage MS and the substrate stage WS hold the mask 55 and the sub...
no. 2 example
[0033] Figure 4 is a schematic diagram illustrating the configuration of the cooling unit of the optical device according to the second embodiment. The same elements as those described in the first embodiment will be referred to by the same reference numerals, and descriptions thereof will not be repeated. The optical device 400 according to the present embodiment is different from the optical device according to the first embodiment in that the heat transfer member 124 a provided near the mirror fixing portion 102 passes through the cooling plate 125 .
[0034] According to the present embodiment, in addition to the Peltier element 301 and the heat sink 303, the heat of the coil 105a is transferred to the cooling plate 125 via the heat transfer member 124a, and collected. Therefore, in this embodiment, since the cooling load of the Peltier element 301 can be reduced more than in the first embodiment, a small-sized Peltier element 301 can be selected. Energy saving can also...
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