An automatic inserting device adapting to flower baskets of different sizes

Abstract

The invention discloses an automatic silicon wafer inserting device capable of adapting to different sizes of baskets, which comprises a rack, a first lifting device, a distributing device, a silicon wafer sucking device, a silicon wafer transmission device and a second lifting device, and is characterized in that the first lifting device, the distributing device, the silicon wafer sucking device, the silicon wafer transmission device and the second lifting device are installed on the rack, the first lifting device and the second lifting device are respectively located at two ends of the silicon wafer transmission device in the transmission direction, two sides of the silicon wafer transmission device are respectively provided with a first protection rod and a second protection rod, and the distance between the first protection rod and the second protection rod can be adjusted. The automatic silicon wafer inserting device can adapt to transportation and insertion of different sizes of silicon wafers through the protection rods with the distance therebetween being adjustable.

Description

technical field [0001] The application belongs to the fields of semiconductor silicon wafer processing and solar cell silicon wafer processing, and in particular relates to an automatic wafer inserting device adaptable to flower baskets of different sizes. Background technique [0002] In the production process of silicon wafers for solar cells, there is a process that requires people to insert the silicon wafers one by one into a special loading box. In the prior art, people usually use manual operations to complete the insertion operation, not only The labor intensity is high, the efficiency is low, and the silicon wafer is easily damaged during the insertion process. [0003] Chinese patent CN203932088U discloses a fully automatic silicon chip inserting machine, which includes a body, the body is provided with a silicon chip output device, a silicon chip transfer device and a loading box, and the silicon chip output device is connected to the silicon chip by a suction cup...

AI Technical Summary

Problems solved by technology

[0004] 1. Unable to adapt to the insertion of silicon wafers of different sizes;

[0005] 2. The silicon wafer in the silicon wafer output device is prone to adhesion between the upper and lower sides;

[0006] 3. After the silicon wafers are loaded, manual handling is still required, and the degree of automation is still not high

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