Unlock instant, AI-driven research and patent intelligence for your innovation.

Direct modulation laser

A laser and direct technology, applied in the direction of lasers, laser components, semiconductor lasers, etc., can solve the problems of no temperature control, difficulty in realizing wavelength division multiplexing, and inconvenient use, so as to suppress chirp and realize wavelength division multiplexing , cost reduction effect

Inactive Publication Date: 2017-06-20
厦门市芯诺通讯科技有限公司
View PDF6 Cites 10 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Directly modulated laser (DFB laser) has become the main light source in optical fiber communication due to its dynamic single-mode and fast response; however, its modulation current will cause the change of the refractive index of the active layer, resulting in the modulation of the phase of the light, thus Broaden the operating frequency; and most of the DFB lasers do not have temperature control at present, resulting in chirp (Chirp) effect, it is difficult to achieve wavelength division multiplexing to achieve long-distance transmission
Some DFB lasers are packaged into temperature-controlled lasers, but they are limited to shell packages, and the cost is relatively high
In addition, the transmission performance of EA lasers is better than that of DFB lasers, but due to the limitation of EA chips, the cost has always been relatively high, and EML laser chips have been monopolized by foreign chip companies, and the price is expensive, which brings inconvenience to people's use.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Direct modulation laser

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0020] The technical solution of this patent will be further described in detail below in conjunction with specific embodiments.

[0021] see figure 1 , a directly modulated laser, including TO tube base 1, TO tube cap 4, thermoelectric cooler 2, laser chip heat sink 5, laser chip 6, backlight monitoring chip 7, detection chip heat sink 8 and substrate 9, thermoelectric cooler 2 Installed on the TO socket 1 and placed under the substrate 9, the thermistor 3, the laser chip heat sink 5 and the detection chip heat sink 8 are arranged above the substrate 9, and the laser chip 6 is installed on the laser chip heat sink 5 , the backlight monitoring chip 7 is installed on the detection chip heat sink 8, the TO tube cap 4 is located at the uppermost part and the TO tube base 1, the TO tube cap 4 and the laser chip 6 are coaxially installed. The placement of the backlight monitoring chip 7 and the laser chip 6 form a fixed angle of 7°±1°, so as to obtain the best backlight current wi...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a direct modulation laser comprising a TO tube base, a TO tube cap, a thermoelectric refrigerating unit, a laser chip heat sink, a laser chip, a backlight monitoring chip, a detection chip heat sink and a base plate. The invention also discloses a manufacturing method of the device. According to the laser provided by the invention, the thermoelectric refrigerating unit is packaged in the laser, is low in power consumption and stable in temperature, and can accurately control the temperature, and thus a chirp effect is effectively inhibited, and wavelength division multiplexing of the DFB laser is achieved; the laser is coaxially packaged, small in size and low in cost, and can be largely applied to a long-distance trunk network; light emitted by the laser chip is directly sent out via a self-converging lens, a secondary lens does not need to be added outside the tube cap, and thus the laser can be directly applied to TOSA and PONTO; the traditional TO adopts a full-reflection sheet to refract a light path upward, so that upward transmission of the light path is achieved; the laser adopts a vertical mounting manner, and does not need the full reflection glass sheet, and thus the cost can be reduced.

Description

technical field [0001] The invention relates to an optical communication device, in particular to a directly modulated laser. Background technique [0002] Semiconductor laser is a light source device in optical fiber communication, which has the characteristics of direct electro-optic conversion, fast response, small size, and long life. There are two main modulation methods of semiconductor laser signals: direct modulation laser (DFB laser) and external modulation laser (EML laser). [0003] Directly modulating a laser refers to modulating the output of the laser by varying the input current. Directly modulated laser (DFB laser) has become the main light source in optical fiber communication due to its dynamic single-mode and fast response; however, its modulation current will cause the change of the refractive index of the active layer, resulting in the modulation of the phase of the light, thus Broaden the operating frequency; and most of the DFB lasers do not have tem...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01S5/024H01S5/02
CPCH01S5/02415H01S5/0206
Inventor 孙全意薛贤铨
Owner 厦门市芯诺通讯科技有限公司