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Packaging structure for linear LED light source

A technology of LED light source and packaging structure, applied in the direction of electrical components, electric solid devices, circuits, etc., can solve the problem of reducing the uniformity of light and color of linear LED light sources, difficulty in ensuring uniform coating of fluorescent glue, poor thermal conductivity of fluorescent glue, etc. problems, achieve better light color consistency, reduce production costs, and achieve consistent concentration

Inactive Publication Date: 2017-07-25
ZHONGSHAN LITI LIGHTING TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the linear LED light source with this packaging structure, the gold wire is used to bond the LED chip, which has a high quality risk; the substrate and the fluorescent glue covering the LED chip have poor thermal conductivity, resulting in the inability to dissipate the heat generated by the LED chip; at the same time, It is difficult to ensure that the fluorescent glue is evenly coated on the substrate and the LED chip, which reduces the light color uniformity of the linear LED light source

Method used

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  • Packaging structure for linear LED light source
  • Packaging structure for linear LED light source

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Embodiment Construction

[0028] It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0029] refer to Figure 1-2 , an embodiment of the present invention is proposed, the packaging structure of the linear LED light source includes a light-emitting component 1 , a conductive plating layer 2 , a connecting terminal 3 and a fluorescent glue sealing layer 4 .

[0030] The light-emitting component 1 is formed by a plurality of flip-chip LED chips 11 arranged in a straight line, and the adjacent electrodes of the adjacent flip-chip LED chips 11 are opposite, and the adjacent electrodes of the adjacent flip-chip LED chips 11 are electrically connected through the conductive coating 2. Connection, that is, the positive electrode 111 of the flip-chip LED chip 11 is electrically connected to the negative electrode 112 of the adjacent flip-chip LED chip 11 through the conductive plating layer 2 .

[0031] The t...

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PUM

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Abstract

The invention discloses a packaging structure for a linear LED light source, and the structure comprises a light-emitting module, connection terminals, a conductive coating layer, and fluorescent glue sealing layers. The light-emitting module comprises one or more LED flip chips which are arranged linearly. The connection terminals are disposed at two ends of the light-emitting module, and are electrically connected with the light-emitting module through the conductive coating layer. The conductive coating layer is electrically connected to the adjacent electrodes of the adjacent LED flip chips. The fluorescent glue sealing layers wrap the light-emitting module and the connection terminals. According to the invention, the structure employs the fluorescent glue sealing layers for fixing the light-emitting module and the connection terminals, saves a substrate, and can be bent randomly. The conductive coating layer is used for achieving the electrical connection of the light-emitting module and the connection terminals, thereby replacing an electrical connection mode where a gold wire is bonded to an LED chip, and improving the stability of a product.

Description

technical field [0001] The invention relates to a linear LED light source, in particular to a packaging structure of the linear LED light source. Background technique [0002] In the common linear LED light sources on the market, multiple LED chips are set on the substrate and bonded to the connecting terminals with gold wires, and coated with fluorescent glue so that the fluorescent glue is coated on the substrate and LED chips, and then The connection terminals at both ends are respectively connected to the two ends of the power supply. In the linear LED light source with this packaging structure, the gold wire is used to bond the LED chip, which has a high quality risk; the substrate and the fluorescent glue covering the LED chip have poor thermal conductivity, resulting in the inability to dissipate the heat generated by the LED chip; at the same time, It is difficult to ensure that the fluorescent glue is evenly coated on the substrate and the LED chip, which reduces t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L25/075H01L33/48H01L33/62H01L33/64
CPCH01L25/0753H01L33/48H01L33/62H01L33/647
Inventor 程胜鹏
Owner ZHONGSHAN LITI LIGHTING TECH