Wireless communication signal high performance testing module and testing method

Abstract

The invention discloses a wireless communication signal high performance testing module and testing method. The method comprises the following steps: configuring a reference clock for the testing module to provide precise synchronization time for an initialization unit and a chip AD9361; configuring the chip AD9361 to work in a transmitting / receiving state via the initialization unit and setting the mode of an auxadc_control, the port mode of a port_control, the control mode of a ctrl_outs_control, the gain mode of a gain_control, the testing mode of a rssi_control, the external gain mode of an elna_control, the input power control mode of a tx_monitor_control and the control mode of an accessory auxadc_control; and processing a zero-middle-frequency data stream converted from signals of each antenna receiving port and outputting the data stream to a field programmable gate array for digital processing by the chip AD9361. By employing the testing system scheme provided by the invention, 12-bit analog-digital and digital-analog conversion radio frequency transmitting and receiving are supported, a transmit frequency band is from 47 MHz to 6 GHz and a receive frequency band is from 70 MHz to 6 GHz, testing sensitivity, noise response and comprehensive precision are improved, and multi-chip synchronization and CMOS / LVDS digital interface support capacity are achieved.

Description

technical field [0001] The invention relates to the field of wireless communication, in particular to a novel module capable of realizing multi-channel high-performance radio frequency and intermediate frequency test processing and a test method thereof. Background technique [0002] With the development of wireless communication, various wireless communication modules emerge as the times require; usually before the wireless communication module is put on the market, it is necessary to conduct electrical performance tests and functional tests on the wireless communication modules, as well as initial configuration. If the wireless communication module is directly welded to the device without testing, once the module has a problem, it will cause the device to malfunction, greatly increasing the defective rate of the product, and also bringing great difficulties to maintenance and production; in addition Since the factory settings of wireless communication modules of different ...

AI Technical Summary

Problems solved by technology

[0003] However, with the continuous improvement of the design level of the communication chip under test, the existing wireless communication module has more powerful functions, and the number and form of the interface break through the original limit and become diversified.

Images