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Resin sheet

A resin sheet and epoxy resin technology, which is applied in the fields of resin sheets, wiring boards, and semiconductor devices, can solve the problems of difficult to cope with the requirements of high performance, miniaturization and limited installation of printed circuit boards.

Active Publication Date: 2017-08-01
AJINOMOTO CO INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the past, such components were only mounted on the surface circuit of the printed circuit board, but the amount of mounting was limited, and it was difficult to meet the requirements of further performance and miniaturization of printed circuit boards in recent years.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1~4 and comparative example 1~4

[0275] (Examples 1-4 and Comparative Examples 1-4: Production of resin sheet)

[0276] A PET film ("LUMIRROR T6AM" manufactured by Toray Co., Ltd.) with a thickness of 38 μm and a softening point of 130°C was prepared, which was treated with an alkyd resin-based release agent ("AL-5" manufactured by Lintec Co., Ltd.) , "Release PET") as a support.

[0277] Each resin varnish was uniformly coated on the release PET with a mouth die coater, so that the thickness of the curable resin composition layer after drying was 25 μm, and dried at 80° C. to 110° C. for 4 minutes, so that it was coated on the release PET. A curable resin composition layer is obtained. Next, on the surface of the curable resin composition layer that is not bonded to the support, a polypropylene film ("Alfan MA-430" manufactured by Oji Eftex Co., Ltd., thickness 20 μm) as a protective film was applied in combination with the curable resin composition layer. Lamination is performed in such a way that the res...

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Abstract

The present invention provides a resin sheet capable of reducing warpage of a substrate and excellent in embedding property. The resin sheet has a support and a curable resin composition layer provided on the support, wherein the curable resin composition layer contains no less than 74% by mass of an inorganic filler. The average particle diameter of the inorganic filler is no more than 1.6 [mu]m, the product of the specific surface area [m<2> / g] and the true density [g / cm<3>] of the inorganic filler is 6 to 8, and the minimum melt viscosity of the inorganic filler is no more than 12,000 poise.

Description

technical field [0001] The present invention relates to a resin sheet, a wiring board, and a semiconductor device. Background technique [0002] In recent years, the demand for small and high-performance electronic devices such as smartphones and tablet PCs has increased. Accordingly, further performance enhancement and miniaturization of printed wiring boards used in these small electronic devices are required. [0003] Components such as bare chips, chip capacitors, and chip inductors are mounted on the printed wiring board. Such components have conventionally been mounted only on the surface circuits of printed wiring boards, but the amount of mounting is limited, and it is difficult to meet the demands for higher performance and miniaturization of printed wiring boards in recent years. [0004] As a solution to the above-mentioned problems, a circuit board with built-in components has been proposed that achieves miniaturization (thinning) while increasing the loading a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08K3/36B32B27/38B32B27/20H05K3/32H01L21/02
CPCH05K3/32H01L21/02C08K3/36B32B27/20B32B27/38C08L63/00H05K3/386H05K3/46C08K2201/003C08K2201/006
Inventor 中村茂雄鸟居恒太柚木诚
Owner AJINOMOTO CO INC