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Method for producing at least one groove or perforation in a plate-shaped workpiece

A plate-shaped workpiece and internal processing technology, applied in metal processing, metal processing equipment, manufacturing tools, etc., can solve problems such as complex processes, and achieve the effect of simplifying plating and shortening pulse duration.

Active Publication Date: 2020-05-19
LPKF LASER & ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

A proven disadvantage is the complexity of the process, which first has to destroy the through-piece by means of radiopaque heat, and then in a subsequent step the diameter of the channel has to be expanded to form the hole

Method used

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  • Method for producing at least one groove or perforation in a plate-shaped workpiece
  • Method for producing at least one groove or perforation in a plate-shaped workpiece
  • Method for producing at least one groove or perforation in a plate-shaped workpiece

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Embodiment Construction

[0051] 1 shows a process diagram of the production of perforations in a plate-shaped workpiece by means of a plurality of process steps by irradiation with a laser beam and subsequent etching, including the individual process steps in the production of perforations in a plate-shaped workpiece 1 . For this, in Figure 1a The middle laser beam 2 is aimed at the workpiece surface. The thickness d of the workpiece 1 amounts to 3 mm here. The duration of the laser beam 2 is chosen to be extremely short, so that the workpiece 1 is only corrected concentrically around the beam axis of the laser beam. The laser operates with a wavelength that is transparent to the workpiece 1 . The region with defective point 3 corrected in this way is in Figure 1b Expressed in the form of a series of linear pores. in the next Figure 1c In the process step shown in , in those regions of the workpiece 1 formed by defect points that have been previously corrected by the laser beam 2 , anisotropic ...

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Abstract

The invention relates to a method for producing at least one, in particular perforated, recess (4) in a plate-shaped workpiece (1) with a thickness of less than 3 mm. To do this, the laser beam (2) is aimed at the surface of the workpiece (1). The duration of the laser beam ( 2 ) is chosen to be very short, so that the workpiece ( 1 ) is corrected only concentrating around the beam axis of the laser beam. The area of ​​the defect point (3) corrected in this way results in a series of pores. In a subsequent process step, due to the action of the etchant, an anisotropic Material removal. As a result, grooves ( 4 ) are formed in the workpiece ( 1 ) as perforations along the cylindrical active area.

Description

technical field [0001] The invention relates to a method for producing at least one groove or perforation in a plate-like workpiece with a thickness of less than 3 mm. Background technique [0002] Microchips, which are magnetic cores for information processors, typically have several hundred contact points closely spaced from one another on the relatively small surface of their underside. Due to the tight spacing, these contact points cannot be processed directly on the circuit board known as the motherboard. Therefore, a so-called interposer made of insulating material is used as connecting element, by means of which the contact substrate can be widened. The insulation and outer wiring layer consist, for example, of glass, glass-fibre-reinforced epoxy resin or silicon and must be provided with numerous perforations. [0003] Glass is particularly advantageous as an interposer material because it is less expensive than silicon and it is compatible with active components s...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/00B23K26/382B23K26/0622
CPCB23K26/0624B23K26/382H05K3/0029H01L2924/0002H05K3/0017B23K2101/40B23K2103/54H01L23/15H01L23/49827H01L21/486C03C23/0025C03C15/00H01L2924/00H01L23/5384
Inventor N.安布罗修斯R.奥斯特霍尔特
Owner LPKF LASER & ELECTRONICS
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