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Lead frame, semiconductor device and method for manufacturing lead frame

A lead frame and semiconductor technology, which is used in semiconductor/solid-state device manufacturing, semiconductor devices, and semiconductor/solid-state device components, etc., can solve problems such as wiring deformation and difficulty in realizing lead frames.

Active Publication Date: 2021-09-28
SHINKO ELECTRIC IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, if wiring is formed by etching a thin metal plate, the possibility of wiring deformation increases
Therefore, it is difficult to realize a lead frame using a metal plate thinner than a certain degree

Method used

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  • Lead frame, semiconductor device and method for manufacturing lead frame
  • Lead frame, semiconductor device and method for manufacturing lead frame
  • Lead frame, semiconductor device and method for manufacturing lead frame

Examples

Experimental program
Comparison scheme
Effect test

no. 1 Embodiment approach

[0065] (The structure of the lead frame)

[0066] figure 1 It is a top view showing an example of the lead frame 1 of the first embodiment. like figure 1 As shown, the lead frame 1 includes a substrate frame 10 having a substantially rectangular shape in a top view, and is arranged in a substrate frame 10 in a manner in which space is spaced therebetween. The unit lead frame group 20 is a group that is arranged in a plurality of unit lead frames 30s of a matrix.

[0067] exist figure 1 In the example, the three unit lead frame groups 20 are arranged in a row. However, the number of unit lead frame groups 20 arranged can be arbitrarily determined. Further, the unit lead frame group 20 can be arranged in multiple columns. Although it is figure 1 A slit 10X is provided between each adjacent cell lead frame group 20, but it is not necessarily provided with a slit 10X.

[0068] For the material of the lead frame 1, for example, copper (Cu), Cu base alloy, iron-nickel (Fe-Ni), Fe-Ni-ba...

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Abstract

The invention provides a lead frame, a semiconductor device and a manufacturing method of the lead frame. A lead frame including: a first lead frame including a first lead; a second lead frame including a second lead bonded to the first lead; and a resin portion provided on the first lead. Between a lead frame and the second lead frame, wherein each of the first lead and the second lead includes an embedding portion embedded in the resin portion, and a protrusion protruding from the resin portion part, the buried part of the first lead and the buried part of the second lead are bonded in the resin part.

Description

Technical field [0001] The present invention relates to a lead frame and a semiconductor device. Background technique [0002] Conventionally, as a semiconductor device including a lead frame, such as a wireless semiconductor device such as a QFN (Quad Flat NO LEAD: quadrilateral-free pin). In the semiconductor device, recently, the number of terminals is needed, and the terminal is set to a plurality of columns, and there should be correspondingly. [0003] However, in order to set the terminal to multiple columns, there is a need to set a wiring with a narrow pitch. The wiring of the lead frame is formed by etching the upper and lower surface of the metal plate. Since etching is carried out not only in the depth direction but also in the width direction, if the metal plate is thicker, the spatial between the wirings is widened, and the wiring cannot be provided to have a narrow pitch. Therefore, a metal plate having a thickness of about 0.2 mm is used in the past. However, in o...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/495H01L21/48
CPCH01L21/4821H01L23/49537H01L23/49558H01L2924/181H01L2224/48091H01L23/49589H01L23/49861H01L23/3142H01L23/49548H01L2924/00012H01L2924/00014H01L23/293
Inventor 笠原哲一郎松泽秀树大串正幸坂井直也
Owner SHINKO ELECTRIC IND CO LTD