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Riveting method of yin-yang copper core plate

A yin-yang copper riveting technology, applied in multilayer circuit manufacturing, electrical components, printed circuit manufacturing, etc., can solve the problems of scrapped production boards and difficult riveting operations, so as to improve production efficiency, reduce product scrap rate, The effect of reducing production costs

Active Publication Date: 2017-08-11
大连崇达电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The present invention aims at the problem that when the existing riveting method is used to rivet the yin and yang copper core boards, the riveting operation is very difficult, and the layer deviation is very likely to occur, which leads to the scrapping of the production board. Riveting method with zero layer deviation scrap rate

Method used

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  • Riveting method of yin-yang copper core plate
  • Riveting method of yin-yang copper core plate

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Experimental program
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Effect test

Embodiment 1

[0021] refer to Figure 1-2 , This embodiment provides a riveting method for a male-female copper core board, wherein the dielectric layer thickness of the male-female copper core board is ≥0.5 mm.

[0022] Specific steps are as follows:

[0023] (1) Provide yin-yang copper core boards and prepregs for subsequent lamination into multi-layer boards. Drill rivet holes on the edges of the yin-yang copper core boards and prepregs respectively. When the yin-yang copper core boards and prepregs overlap, the rivets on both The holes overlap one by one. The yin-yang copper core board is rectangular, and three rivet holes are drilled on the two long sides, and one rivet hole is drilled on the two short sides, such as figure 1 shown. In other embodiments, the number of rivet holes per plate may be greater than eight, with at least three rivet holes on the long side and at least one rivet hole on the short side.

[0024] (2) Laminate the male-female copper core board and the prepreg ...

Embodiment 2

[0032] This embodiment provides a riveting method for a male-female copper core board, the thickness of the dielectric layer of the male-female copper core board is less than 0.5 mm.

[0033] Specific steps are as follows:

[0034] (1) Provide yin-yang copper core boards and prepregs for subsequent lamination into multi-layer boards. Drill rivet holes on the edges of the yin-yang copper core boards and prepregs respectively. When the yin-yang copper core boards and prepregs overlap, the rivets on both The holes overlap one by one. The yin-yang copper core board is rectangular, and three rivet holes are drilled on the two long sides, and one rivet hole is drilled on the two short sides.

[0035] (2) According to the stacking sequence, the yin and yang copper core boards and prepregs are stacked together to form a stacked board structure.

[0036] (3) Insert the two punching pins of the three-axis rivet machine into the two rivet holes on the same edge of the stacked plate str...

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Abstract

The invention relates to the technical field of circuit board production, and particularly to a riveting method for a yin-yang copper core plate. According to the invention, a pressing plate is disposed on a stacked plate structure and applies a downward pressure to the stacked plate structure to press a bent yin-yang copper core plate in the stacked plate structure to be relatively flat, so that a punching needle of a triaxial rivet machine can be easily inserted into other rivet holes in the stacked plate structure, thereby solving the problem that it is difficult for the punching needle to be inserted into the rivet holes to work. The pressing plate is kept to be placed on the stacked plate structure until a plate arranging process, which avoids the problem that layer deviation appears due to rivet hole cracking caused by inward tension force of the thinner yin-yang copper core plate when the stacked plate structure loses the downward pressure. The riveting method of the invention is simple and easy to implement, can reduce the scrapping rate of layer deviation after riveting without significantly increasing extra costs, greatly reduces the product scrapping rate, improves the production efficiency and lowers the production cost.

Description

technical field [0001] The invention relates to the technical field of circuit board production, in particular to a riveting method for a male-female copper core board. Background technique [0002] With the diversification of circuit board products, more and more circuit board products use yin-yang copper core boards (yin-yang copper core boards refer to core boards with inconsistent copper layer thicknesses on the upper and lower surfaces). Since the thickness of the copper layer on the upper and lower surfaces of the core board is inconsistent, the core board is easily bent during the production process. When the core board enters the pressing process, it is necessary to drill rivet holes on the edge of the core board and the prepreg, and then stack the core board and the prepreg in a certain order and rivet them through a riveting machine or a fusion machine. The difficulty is high, the punching pin of the rivet machine is difficult to fit into the rivet hole, and even ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/46
CPCH05K3/4638H05K2203/0214H05K2203/068
Inventor 欧阳戴勇杨长锋张华勇
Owner 大连崇达电子有限公司