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Base plate cutting machine and base plate cutting control method

A control method and cutting machine technology, applied in the direction of metal processing, etc., can solve the problems of prolonging the production cycle, and achieve the effects of improving processing efficiency, shortening the cycle, and reducing waiting time

Inactive Publication Date: 2017-08-15
HKC CORP LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Since the carrying platform needs to move during the cleaning of residual materials, the upstream equipment must wait for the substrate cutting machine to complete the cleaning of the residual materials before transporting the substrate to the carrying platform. When the upstream equipment transports the substrate, the substrate cutting machine is in a waiting state, resulting in extended production cycle

Method used

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  • Base plate cutting machine and base plate cutting control method
  • Base plate cutting machine and base plate cutting control method

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Embodiment Construction

[0027] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0028] It should be noted that all directional indications (such as up, down, left, right, front, back...) in the embodiments of the present invention are only used to explain the relationship between the components in a certain posture (as shown in the accompanying drawings). Relative positional relationship, movement conditions, etc., if the specific posture changes, the directional indication will also change accordingly.

[0029] In the present in...

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Abstract

The invention discloses a substrate cutting machine and a substrate cutting control method, wherein the substrate cutting machine includes a bearing platform, which carries the substrate; residual materials; and a funnel assembly, the funnel assembly intermittently slides below the split mechanism to receive the residual materials dropped by the split mechanism. The processing cycle of the substrate cutting machine of the invention is short, and the processing efficiency of the substrate cutting machine is high.

Description

technical field [0001] The present invention relates to the technical field of display panel production, in particular to a substrate cutting machine and a substrate cutting control method using the substrate cutting machine. Background technique [0002] In the production process of liquid crystal panels, in the photo-alignment process, the power-on terminals on the thin film transistor substrate need to be exposed by cutting off a section of the color filter substrate. During the cutting process of the glass substrate, residual materials will be generated, and the residual materials are generally passed through the split mechanism. Removed after clamping. [0003] In the existing substrate cutting machine, the residual material funnel for receiving the residual material is usually fixed on the outside of the carrying platform for carrying the substrate, so during the cutting process of the liquid crystal panel, the carrying platform of the substrate cutting machine needs t...

Claims

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Application Information

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IPC IPC(8): B26D7/20B26D7/18
CPCB26D7/20B26D7/18
Inventor 黄俊钦
Owner HKC CORP LTD