Manufacturing process of silicon wafer circuit board of LED lamp

Abstract

The purpose of the present invention is to provide a manufacturing process of a silicon wafer circuit board for LED lamps. The manufacturing process steps of its silicon wafer circuit board are: (1) fixing the slice, fixing the single crystal silicon rod prepared in advance on the processing table, Then the single crystal silicon is cut into single crystal silicon wafers with uniform thickness, (2) thermal annealing treatment, the single crystal silicon wafer after the previous step of slicing is heated at a high temperature through a thermal oxidation furnace and annealed, (3) chamfering Finishing treatment, the edge of the monocrystalline silicon wafer after the step 2 annealing treatment is carried out through the fine grinding wheel for grinding and finishing treatment, (4) grinding and cleaning treatment of the silicon wafer circuit board, preventing the silicon atoms on the surface of the circuit board from chemical reaction, preventing The formation of depressions and holes on the surface of the circuit board and the processing of the corners of the circuit board can greatly improve the orderliness of the corners of the circuit board, improve the curvature and flatness of the silicon surface, and improve the quality of the circuit board.

Description

technical field [0001] The invention relates to the field of processing technology of LED lamps, in particular to the improvement of the processing of silicon circuit boards of LED lamps, and in particular to a manufacturing process of silicon circuit boards of LED lamps. Background technique [0002] With the improvement of living standards, people have relatively high requirements for daily lighting. LED lights are also widely used for lighting. Therefore, a large amount of processing and manufacturing of silicon circuit boards for LED lights is required. In the production of circuit boards in the past, due to the unreasonable production methods used, the surface of the circuit board is easy to trigger chemical reactions during production, resulting in surface depressions and holes on the surface of the circuit board, which affects the wiring and wiring of the entire circuit board. Therefore, the scrap rate of the circuit board is greatly improved, the production efficienc...

AI Technical Summary

Problems solved by technology

[0002] With the improvement of living standards, people have relatively high requirements for daily lighting. LED lights are also widely used for lighting. Therefore, a large amount of processing and manufacturing of silicon circuit boards for LED lights is required. In the production of circuit boards in the past, due to the unreasonable production methods used, the surface of the circuit board is easy to trigger chemical reactions during production, resulting in surface depressions and holes on the surface of the circuit board, which affects the wiring and wiring of the entire circuit board. Therefore, the scrap rate of the circuit board is greatly improved, the production efficiency is reduced, and the production cost is also increased.