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Manufacturing method of electronic components

A technology for electronic components and manufacturing methods, which can be used in the manufacture of capacitors, parts of fixed capacitors, and electrical components, and can solve problems such as reduced moisture resistance and reduced adhesion of the coated dielectric part.

Active Publication Date: 2019-10-01
MURATA MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For this reason, in order to improve the moisture resistance in the side margin, if the resin component contained in the coating dielectric part constituting the side margin is reduced and the density of ceramic particles is increased, the adhesiveness of the coating dielectric part will decrease, resulting in Make it difficult to attach the coating dielectric part to the entire side surface of the chip
If there is a portion on the side of the chip where the dielectric coating is not attached, the moisture resistance in the side margin will decrease

Method used

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  • Manufacturing method of electronic components
  • Manufacturing method of electronic components
  • Manufacturing method of electronic components

Examples

Experimental program
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Effect test

experiment example

[0103] As the experimental conditions, the temperature of the first pressurized body 170, the respective rotational speeds of the first pressurized body 170 and the second pressurized body 171, and the temperature of the first pressurized body 170 and the second pressurized body 171 The linear pressures were varied respectively, and the stability of bonding of the first dielectric sheet 150g for covering and the second dielectric sheet 151g for covering was verified. As for the bonding stability of the first dielectric sheet 150g for covering and the second dielectric sheet 151g for covering, the case where no peeling was confirmed at the bonding interface was judged to be good, and the case where a small amount of peeling was confirmed at the bonding interface was judged to be good. The condition of the place was judged to be acceptable, and the case where the bonding interface was integrally peeled off was judged to be unacceptable.

[0104] 【Table 1】

[0105]

[0106] T...

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Abstract

The present invention relates to a method of manufacturing an electronic component. The method comprising the steps of: preparing a chip containing stacked a plurality of dielectric layers and a plurality of internal electrode layers, wherein the plurality of internal electrode layers are exposed on a side surface; forming a dielectric laminated sheet (S7) by bonding a plurality of coated dielectric sheets to each other; laminating dielectric laminated sheets on the side of the chip (S8).

Description

technical field [0001] The present invention relates to a method of manufacturing electronic components, and in particular to a method of manufacturing small electronic components. Background technique [0002] As a conventional document disclosing the structure of a multilayer ceramic capacitor as an electronic component, there is Japanese Unexamined Patent Publication No. 62-237714 as Patent Document 1 . In the multilayer ceramic capacitor described in Patent Document 1, a plurality of internal electrodes are formed so as to leave side margins on each side surface of the laminate. In the unfired stage of the laminated body, a ceramic slurry having the same composition as the ceramic material constituting the chip is added to the part other than the side margin of the laminated body, that is, the chip, thereby forming a covered dielectric part constituting the side margin of the laminated body . A laminated body is formed by integrally firing the chip provided with the co...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01G13/00
CPCH01G13/00H01G4/012H01G4/1209H01G4/30
Inventor 森山晃司福永大树田中秀明
Owner MURATA MFG CO LTD
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