Cured epoxy resin dissolving agent and application thereof
A technology of curing epoxy resin and application method, which is applied in recycling technology, plastic recycling, etc., can solve the problems of long time, cumbersome process, and high corrosion of metal equipment, and achieve fast dissolution, broad application prospects, and application effects Good results
Active Publication Date: 2017-08-29
GUILIN UNIV OF ELECTRONIC TECH
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Problems solved by technology
[0003] At present, there are two main types of research on epoxy resin dissolving agents: 1. Dissolving epoxy resin under acidic conditions, such as Chinese patent CN200810303667.3, this method uses a large amount of formic acid and sulfuric acid, which has greater corrosion to metal equipment ; Two, organic solvents, such as Chinese patent CN201310456230.4, this method needs to reflux and stir for 0.5-1 hour, the process is more loaded down with trivial details, and the time is longer
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[0026] 1. The preparation process of curing epoxy resin dissolving agent is:
[0027] Take a 50ml beaker, add 2g of sodium hydroxide, 20ml of ethylene glycol methyl ether, 2.5ml of diethylenetriamine, 10ml of toluene, and 12.5ml of dichloromethane in order, then stir in a rotor mixer for 30min , until sodium hydroxide dissolves completely, obtains curing epoxy resin dissolving agent;
[0028] 2. Cured epoxy resin dissolution process:
[0029] Add the cured epoxy resin dissolver to the oil bath, adjust the temperature to 130°C, and then put the electronic device sample containing the cured epoxy resin into the cured epoxy resin dissolver. After 10 minutes, take out the sample and wash it with water. Can.
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The invention provides a cured epoxy resin dissolving agent which is formed by mixing diethylenetriamine, methylbenzene, dichloromethane, ethylene glycol monomethyl ether and sodium hydroxide. The preparation method of the cured epoxy resin dissolving agent comprises the following steps: sequentially adding the sodium hydroxide, ethylene glycol monomethyl ether, diethylenetriamine, methylbenzene and dichloromethane, and stirring until the sodium hydroxide is completely dissolved, thus obtaining the cured epoxy resin dissolving agent. The cured epoxy resin dissolving process comprises the following steps: dissolving an electronic device sample containing a cured epoxy resin into the cured epoxy resin dissolving agent, and cleaning with clean water. The cured epoxy resin dissolving agent disclosed by the invention has the advantages that 1, the cured epoxy resin packaged by the electronic device can be dissolved, and metal components in the electronic device are not damaged; 2, the preparation process is simple, and large-scale preparation can be realized; and 3, the application effect is excellent, and the dissolving speed is high. Therefore, the cured epoxy resin dissolving agent disclosed by the invention has wide application prospects in the fields of small electronic package and epoxy resin coated metal base recovery.
Description
technical field [0001] The invention relates to the technical field of dissolving agents, in particular to a curing epoxy resin dissolving agent and an application method thereof. Background technique [0002] The molecular structure of epoxy resin contains active epoxy groups, so that they can react with a variety of different curing agents to form a polymer with a three-dimensional network structure, which is curing. The cured epoxy resin has good physical and chemical properties. It has excellent bonding strength to the surface of metal and non-metal materials, good dielectric properties, small deformation shrinkage, good dimensional stability of products, high hardness and flexibility. Better, so the application field is very wide, such as packaging and casting of electronic devices. It is these advantages that make it difficult to extract the metal or recyclable substances inside after epoxy resin encapsulation, which runs counter to my country's sustainable developmen...
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IPC IPC(8): C08J11/28C08L63/00
CPCC08J11/28C08J2363/00Y02W30/62
Inventor 邹勇进蔡成龙向翠丽孙立贤徐芬
Owner GUILIN UNIV OF ELECTRONIC TECH