Fiber interface module

Abstract

The present invention is suitable for the fiber communication field, and provides a fiber interface module. The module comprises a metal tail plug, a ceramic bushing, a second ceramic ferrule, a metal pedestal, a first ceramic ferrule and a fiber. The metal pedestal comprises a first cavity and a second cavity, the first cavity is arranged at the top of the second cavity, the first cavity is communicated with the second cavity, there is an included angle arranged between the central axis of the first cavity and the central axis of the second cavity, the metal pedestal is arranged at the top in the metal tail plug, the tail end of the second ceramic ferrule is inserted into the ceramic bushing, the top end of the second ceramic ferrule is inserted into the second cavity, the first ceramic ferrule is inserted into the first cavity, and the fiber is arranged on the central axis of the first cavity and the central axis of the second cavity. The fiber interface module can effectively solve the problem that the coupling power is low caused by light deflection of a laser, can obtain high echo loss, greatly improve the production yield and the product performance and reduce the cost.

Description

technical field [0001] The invention belongs to the field of optical fiber communication, in particular to an optical fiber interface component. Background technique [0002] Optical fiber interface components are used as optical passive parts connecting light-receiving elements and light-emitting elements in the optical modules of optical communication transceivers. As one of the optical components of optical fiber communication transceiver modules, the semiconductor laser emits a mode field diameter of optical signals that are generally larger than The core diameter of an optical fiber used as a single-mode optical signal transmission path is smaller than 9 μm. The current semiconductor laser chip technology is basically mastered by Germany, the United States, Japan and other developed countries, mainly Nanoplus, Eagleyard, NTT, Thorlabs and other companies; the main domestic procurement of chip packaging, so the cost is expensive. [0003] Because the laser process is co...

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Problems solved by technology

[0004] The purpose of the present invention is to provide an optical fiber interface assembly, which aims to solve the problem of complex manufacturing process and high technical requirements in the prior art, and there is deviation in the consistency of the laser output angle during the packaging process, which leads to low coupling power and cannot meet the requirements for communication use.

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