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Power semiconductor module and electric power steering device using same

A technology of electric power steering and power semiconductors, which is applied in the direction of output power conversion devices, electric steering mechanisms, semiconductor devices, etc., to achieve low cost and space saving effects

Inactive Publication Date: 2019-07-05
NSK LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Conventionally, electronic circuits that use power semiconductors that handle high power such as inverter circuits and power supply circuits may require further miniaturization in conjunction with the miniaturization of equipment using such circuits.

Method used

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  • Power semiconductor module and electric power steering device using same
  • Power semiconductor module and electric power steering device using same
  • Power semiconductor module and electric power steering device using same

Examples

Experimental program
Comparison scheme
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Embodiment Construction

[0037] Next, an embodiment of the present invention will be described by taking, as an example, a case where a configuration example of the power semiconductor module of the present invention is applied to a control device of an electric motor used in an electric power steering device or the like of a vehicle.

[0038] Here, the above-mentioned electric power steering apparatus is used to apply a steering assist force (assist force) to a steering mechanism of a vehicle by a rotational force of an electric motor. Furthermore, in the above-mentioned electric power steering device, the driving force of the electric motor controlled by the electric power supplied from the electric power supply unit (inverter) is transmitted to the steering shaft or gears through the transmission mechanism such as gears or belts through the reduction mechanism. The bar axis applies the steering assist force mentioned above. Furthermore, such an electric power steering system (EPS) performs feedback...

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PUM

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Abstract

Technical problem: Miniaturize and integrate multiple power semiconductors of an electronic circuit composed of multiple power semiconductors without causing problems such as heat dissipation at low cost. Solution: Provide a power semiconductor module, which is formed by arranging and storing a plurality of power semiconductor elements in the same package. The power semiconductor bare chip on the metal plate and other external connection terminals electrically connected to other electrode parts of the semiconductor bare chip, the plurality of power semiconductor elements basically have the same shape, the plurality of power semiconductor elements A part of the electrodes of the bare chip of the element is connected to each other among the plurality of power semiconductor elements through metal connectors or leads, and the package is to enclose the plurality of power semiconductor elements with an electrically insulating resin. Sealed resin molded package.

Description

technical field [0001] The present invention relates to a power semiconductor module in which at least two or more power semiconductors mounted on a metal plate are functionally connected and accommodated in a single package, and an electric power steering device using the same. Background technique [0002] Conventionally, electronic circuits using power semiconductors that handle high power, such as inverter circuits and power supply circuits, have sometimes required further miniaturization in order to match the miniaturization of devices using such circuits. Furthermore, in order to further reduce the size of circuits using such power semiconductors, it is also necessary to efficiently dissipate heat from power semiconductors and the like mounted at a high density in order to achieve size reduction at low cost. [0003] For example, in a control device of a rotating electrical device such as a motor used in an electric power steering (EPS) of a vehicle such as an automobi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L25/07H01L25/18
CPCH01L2924/181H01L2224/0603H01L2224/48137H01L2224/48247H01L2224/48472H01L2224/4903H01L2224/49111H01L2224/49175H01L2924/0002H01L23/3107H01L23/49562H01L23/49575H01L2924/00014H01L2924/00012H01L2924/00H01L2224/45099H02P6/28B62D5/04H01L23/13H01L23/14H01L23/50H01L24/48H01L24/49H01L25/0655H01L2224/48141H01L2224/48175H01L2224/49112H01L2924/15724H01L2924/15747H02M7/53871H02P27/08
Inventor 嶋川茂须永崇关根孝明
Owner NSK LTD