Method for manufacturing semiconductor device and semiconductor device
A semiconductor and substrate technology, applied in the direction of semiconductor devices, semiconductor/solid-state device manufacturing, semiconductor/solid-state device components, etc.
Active Publication Date: 2021-02-05
TAIWAN SEMICON MFG CO LTD
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- Abstract
- Description
- Claims
- Application Information
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Problems solved by technology
Therefore, there is pressure to reduce the size of the fingerprint package containing the fingerprint sensor without seeing a reduction in performance
Method used
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[0013] The following disclosure provides many different embodiments, or examples, for implementing the various features of the disclosure. To simplify the present disclosure, specific examples of components and configurations are described below. These are of course examples only and are not intended to be limiting. For example, in the description below, forming a first feature over or on a second feature can include embodiments in which the first and second features are formed in direct contact, and can also include embodiments in which additional features can be formed on the first and second features. An embodiment in which the first and second features are not in direct contact between two features. Additionally, the present disclosure may repeat reference numbers and / or letters in various instances. This repetition is for simplicity and clarity and does not in itself determine the relationship between the various embodiments and / or configurations discussed.
[0014] Fu...
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Abstract
The present disclosure provides a method of manufacturing a semiconductor device and the semiconductor device. The semiconductor device includes: a sensor chip; a through via electrically connecting a first side of the sensor chip to a conductive element located on a second side of the sensor chip, the second side being opposite to the first side; a high voltage chip electrically connected to the through via and a substrate electrically connected to the through via, wherein the high voltage chip is located in the opening of the substrate.
Description
technical field [0001] The disclosure relates to a method of manufacturing a semiconductor device and the semiconductor device, and in particular to a fingerprint sensor device and a manufacturing method thereof. Background technique [0002] As user devices become smaller and more portable, it becomes easier for malicious actors to steal user devices. When these devices carry sensitive data of the user, a thief may be able to access the data unless barriers have been placed in the user's device. Once such a barrier is a fingerprint sensor, which can be used to read the fingerprint of the person trying to access the device, if the fingerprint is not identical to the user's, access may be denied. [0003] However, as user devices such as cell phones become smaller, there is pressure to simultaneously see a reduction in size on each of the individual components within the user device as well. Therefore, there is pressure to reduce the size of the fingerprint package containi...
Claims
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IPC IPC(8): G06K9/00H01L23/522H01L25/16
CPCH01L23/522H01L23/5226H01L25/04G06V40/1306H01L2224/32225H01L2224/73267H01L2224/92244H01L2224/24227H01L2224/13111H01L2224/13139H01L2224/13147H01L2224/11849H01L2224/11462H01L2224/1145H01L2224/1132H01L2224/11334H01L2224/81024H01L2224/81815H01L2224/81911H01L2224/16237H01L2224/81444H01L2224/81447H01L2224/81005H01L2224/73204H01L2224/92125H01L2224/16227H01L2224/16145H01L2224/1703H01L2224/32145H01L2224/16146H01L2224/0401H01L2224/02377H01L2224/02381H01L2224/02372H01L24/19H01L24/20H01L24/32H01L24/11H01L24/17H01L24/13H01L24/16H01L24/73H01L24/81H01L24/92H01L2224/0557H01L2224/05009H01L2224/05008H01L2224/05147H01L2224/05166H01L2224/05184H01L2224/05171H01L2224/05155H01L2224/05644H01L2224/05647H01L2224/0345H01L2224/0346H01L2224/03462H01L24/03H01L24/05H01L2224/81191H01L25/16G06V40/1318H01L2924/014H01L2924/00014H01L2924/00H01L2224/16225H01L23/481H01L23/49827H01L23/49822H01L23/525H01L24/02G06V40/1329G06V40/12H01L21/56H01L21/76885H01L21/76898H01L23/3128H01L23/49838H01L2224/0231H01L2224/024H01L2224/03452H01L2224/05024H01L2224/05082H01L2224/05083H01L2224/05144H01L2224/8101H01L2924/01013H01L2924/01022H01L2924/01029H01L2924/01074H01L2924/0132H01L2924/04941H01L2924/04953H01L2924/06H01L2924/07025H01L2924/15311H01L2924/2064
Inventor 余振华陈玉芬陈志华蔡豪益刘重希
Owner TAIWAN SEMICON MFG CO LTD