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Epoxy Resin Composition for Die Bonding

An epoxy resin and chip bonding technology, applied in the direction of epoxy resin glue, novolac epoxy resin adhesive, adhesive type, etc., can solve the problems of low adhesion, high surface viscosity, unfavorable operation, etc. , to achieve the effect of convenient operation and high adhesive strength

Active Publication Date: 2017-09-12
KCC CORP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, there is a problem that the above-mentioned resin paste for die bonding has low adhesive force, and has high surface tackiness after the B-stage, making subsequent handling unfavorable

Method used

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  • Epoxy Resin Composition for Die Bonding

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1 and comparative example 1 and 2

[0049] Example 1 and Comparative Examples 1 and 2: Preparation of epoxy resin composition for die bonding

[0050] The components were mixed with the composition shown in Table 1 below to prepare an epoxy resin composition for die bonding (unit: wt%).

[0051] [Table 1]

[0052]

[0053] 1) Hypro 1300X13NA CTBN (CVC thermoset specialties)

[0054] 2) B-Tough A3(Croda)

[0055] 3)EOCN-1020(Nippon kayaku)

[0056] 4) YDCN-500-4P (Kukdo Chemical)

[0057] 5) CNE80208(KCC)

[0058] 6) MEH-7800SS(Meiwa)

[0059] 7) DICY (Air product)

[0060] 8) Carbitol Acetate (Samchun Chemical)

[0061] 9) AEROSIL R 972(EVONIK)

[0062] 10) SFP-30M (Denka)

[0063] 11) EP-2601(Dow corning)

[0064] 12) IXEPLAS-A1(Toagosei)

[0065] 13) IXE-600(Toagosei)

[0066] 14) LC550(SHIN-A T&C)

[0067] 15) BYK110(BYK Additive&Instruments)

[0068] 16) BYK-085(BYK Additive&Instruments)

[0069] 17) BYK-A501(BYK Additive&Instruments)

[0070] 18) S-510(CHISSO)

experiment example 1

[0072] The physical properties of the epoxy resin compositions prepared in Example 1 and Comparative Examples 1 and 2 were measured by the following methods, and the results are shown in Table 2 below.

[0073] (1) Viscosity and thixotropy index

[0074] Take a sample of about 0.5 ml of the composition, and measure the viscosity at 25° C. at a rotation speed of 0.5 rpm and 25 rpm in a Brookfield cone / plate viscometer using a rotor CP-51. The value measured at 5 rpm was taken as the viscosity value, and the thixotropic index was calculated as the ratio of the two viscosity values ​​measured at 0.5 rpm and 5 rpm, that is, the value measured at 0.5 rpm / the value measured at 5 rpm.

[0075] (2) Glass transition temperature (Tg) and elastic modulus

[0076] A sample of the composition was coated in a thickness of 0.2 mm and cured at 125° C. / 30 minutes and 175° C. / 120 minutes, and then measured in a tensile mode using Perkin ELmer DMA 8000.

[0077] (3) Laboratory shear strength

[0078] Acco...

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Abstract

The invention provides an epoxy resin composition for die bonding and a semiconductor device manufactured by use of the epoxy resin composition. The epoxy resin composition comprises epoxy resin, an elastomer, curing agent, fillers and solvent. The elastomer comprises an elastomer with the epoxy group and the curing agent comprises solid amine compounds.

Description

Technical field [0001] The present invention relates to an epoxy resin composition for die bonding, and more specifically, to an epoxy resin composition for die bonding, which has high adhesive strength and can be used in packaging. The modulus of elasticity to realize the cushioning effect in the middle, and has low viscosity, making subsequent operations convenient. Background technique [0002] Generally, as a bonding material (ie, die bonding material) between a semiconductor element (such as an integrated circuit IC or a large-scale integrated circuit LSI) and a supporting member (such as a lead frame and an insulating support substrate), Au-Si is known Crystal alloy, solder, silver paste, etc. [0003] However, as current semiconductor packages have become smaller and lighter, the use of insulating support substrates has become more widespread, and in order to reduce production costs, it aims to use printing methods that provide good applicability for mass production to supp...

Claims

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Application Information

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IPC IPC(8): C09J201/06C09J163/04C09J163/00C09J183/04C09J11/04H01L23/29
CPCC09J201/06C08K2201/014C08L2203/206C08L2205/02C08L2205/035C09J11/04H01L23/295H01L23/296C08L63/04C08L63/00C08L83/04C08K3/36
Inventor 朴钟赫金伦基段澈湖
Owner KCC CORP CO LTD