A magnetron sputtering device and method for silver-plating the inner wall of a reduction cover for polysilicon production

Abstract

The invention provides a magnetron sputtering device and method for silver plating of the inner wall of a reduction cover used for polycrystalline silicon production. The magnetron sputtering device comprises a reduction cover base, a vacuum pump set, a rotating frame, a cathode assembly and a rotating driving mechanism. The reduction cover base is used for containing the reversely-buckled reduction cover. The rotating frame is arranged above the reduction cover base. The lower end of the rotating frame is driven to rotate through the rotating driving mechanism. A rotating shaft is further internally provided with an argon input hole. The cathode assembly comprises a plurality of cathode pieces, and the cathode pieces are arranged on side frame bodies and a top frame body of the rotating frame. Each cathode piece comprises magnetic steel and a silver target. Magnetic force line runways of magnetic fields of the magnetic steel point to the inner wall of the reduction cover. In addition, a power source is connected to the cathode pieces and used for allowing negative voltages to be formed between anodes and cathodes. The vacuum pump set is used for vacuumizing a sealed space. According to the magnetron sputtering device and method for silver plating of the inner wall of the reduction cover used for polycrystalline silicon production, silver plating is conducted on the inner wall of the reduction cover, the bonding strength of a silver layer on the inner wall of the reduction cover is high, and in addition, the magnetron sputtering device and method are low in cost and can be widely applied and popularized in enterprises in China.

Description

technical field [0001] The invention relates to a magnetron sputtering device and method for silver-plating the inner wall of a reduction cover for polysilicon production. Background technique [0002] High-purity polysilicon is the basic raw material for the electronics and solar photovoltaic industries. Most of the production of polysilicon adopts the improved Siemens process, and the reduction furnace is one of the core equipment for polysilicon production. The polysilicon reduction furnace mainly consists of a double-layer bell-type furnace. body, chassis and other accessories. Since the production of polysilicon is carried out under the conditions of high temperature of 1300 degrees and strong acid, in order to reduce the pollution of equipment materials to polysilicon products and resist high temperature chemical corrosion, the furnace body of the reduction furnace is generally made of stainless steel 316 material. [0003] The production of polysilicon consumes a lar...

AI Technical Summary

Problems solved by technology

The existing measure is to plate a silver layer on the inner wall of the reduction cover, but through the existing technical means to silver-plate the inner wall of the reduction cover, the bonding strength of the silver layer on the inner wall of the reduction cover is low, so far there is no good method to coat the silver layer It is firmly combined with the inner wall of the reduction cover. There is a foreign method to attach the silver plate to it by explosive molding, but the cost is high and domestic enterprises cannot accept it.

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