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High density sensor module group

A sensor module, high-density technology, applied in the direction of instruments, measuring devices, measuring force, etc., can solve the problems of low sensing density and sensing resolution of pressure sensor modules, and achieve increased sensing density and sensing. The effect of increased resolution, distribution density, and increased number

Inactive Publication Date: 2017-09-12
HONG FU JIN PRECISION IND (SHENZHEN) CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In the prior art, the pressure sensor modules are mostly single-layer design, and the sensing density and sensing resolution of the pressure sensor modules are not high

Method used

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  • High density sensor module group
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Embodiment Construction

[0015] Please attach below Figure 1-5 A high-density pressure sensor provided by the present invention will be further described in the following examples and embodiments.

[0016] see Figure 1-3 , the first embodiment of the present invention provides a high-density sensor module 100 , the high-density sensor module 100 includes a sensing region 110 and a non-sensing region 120 surrounding the sensing region 110 .

[0017] The high-density sensor module 100 includes a substrate 130 , a plurality of sensors 140 , a plurality of conductive rods 160 and a package 170 . The substrate 130 includes a circuit board 10 , a second support 20 and a first support 30 . The circuit board 10 includes a first surface 11 and a second surface 12 opposite to the first surface 11 . The second support 20 is formed on the second surface 12 , and the first support 30 is formed on the first surface 11 .

[0018] The circuit board 10 can be one of a flexible circuit board, a rigid circuit boar...

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Abstract

A high-density sensor module, comprising: a substrate, the substrate includes a circuit board; a first support formed on the circuit board, the first support includes at least one sensing slot, the sensing slot includes A first side wall, the angle between the first side wall and the circuit board exposed from the sensing groove is not less than 90°; at least one sensor formed on the first side wall, the sensor and The circuit board is electrically connected; and at least one conduction rod accommodated in the sensing groove; when the conduction rod is subjected to a positive pressure, the conduction rod will slide along a direction perpendicular to the circuit board and squeeze the sensor , to transmit the pressure from the conducting rod to the sensor. The high-density sensor module provided by the invention increases the sensing density and sensing resolution of the sensor.

Description

technical field [0001] The invention relates to a pressure sensor module, in particular to a high-density pressure sensor module. Background technique [0002] More and more pressure sensors are used in various industrial self-control environments, involving water conservancy and hydropower, railway transportation, intelligent buildings, production self-control, aerospace, military industry, petrochemical, oil wells, electric power, ships, machine tools, pipelines, medicine and many other industries . With the rapid development of science and technology, the demand for high-density pressure sensors is also increasing. [0003] In the prior art, most of the pressure sensor modules are of a single-layer design, and the sensing density and sensing resolution of the pressure sensor modules are not high. Contents of the invention [0004] In view of this, the present invention provides a high-density pressure sensor module with high sensing density and high sensing resolution...

Claims

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Application Information

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IPC IPC(8): G01L1/00
CPCG01L1/00
Inventor 吴宗儒张仁淙谢欣倍林奕丞
Owner HONG FU JIN PRECISION IND (SHENZHEN) CO LTD