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Coating agent and method of forming a coating layer using thereof

A coating and coating technology, applied in the direction of coating, device for coating liquid on the surface, temporary coating, etc., can solve the problem of difficult to apply semiconductor wafer processing technology, laminated film can not be uniformly bonded, easy to damage surface protection film and other problems, to achieve the effect of less variation, excellent flatness and low price

Active Publication Date: 2017-09-19
K C TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] However, the above-mentioned protective film is expensive, and various foreign substances including flying dust flow in during the bonding process, causing uneven bonding state, and remaining adhesive components during the peeling process. Therefore, there is a need to separately Carrying out other processes and many other issues
figure 1 It is a diagram showing the above-mentioned problem. For the surface state of the workpiece using the conventional protective adhesive film, foreign matter ( figure 1 a, b, f) or silica dust (c, d), or the laminated film cannot be bonded uniformly ( figure 1 e), Back Side Chipping (Back Side Chipping) ( figure 1 h) Bad
[0009] Also, in order to prevent the film from peeling off during processing, it is necessary to have sufficient adhesion to the surface and the characteristics of easy removal after processing, but these two characteristics are opposite characteristics, so it is difficult to satisfy both, and in order to improve packaging reliability When double-sided grinding is carried out to a semiconductor crystal with a surface protection film, the surface protection film is easily damaged due to the high adhesion of the adhesion film, so that the use of the adhesion film is also limited.
[0010] Therefore, it is considered to form a temporary coating with a liquid coating agent, but it is difficult to achieve peeling due to the curing method such as UV, and, due to the circular coating area or the thickness deviation of the coating thickness, the actual Difficult to apply to semiconductor wafer processing technology that requires high flatness

Method used

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  • Coating agent and method of forming a coating layer using thereof
  • Coating agent and method of forming a coating layer using thereof
  • Coating agent and method of forming a coating layer using thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0126] A composition (1) consisting of 65% by weight of polyvinyl chloride slurry resin (EL103 of Hanwha Petrochemical) and 35% by weight of trioctyl trimellitate (TOTM) having Newtonian fluid characteristics was discharged using a quantitative discharge pump. It is discharged to the surface of the semiconductor wafer, and then the upper plate in the mold is pulled down, and the 2 After performing thermocompression bonding, heat treatment was performed at 150° C. for 10 minutes, and then, after the pressing was released, the formed film was removed with a remover. At this time, as the polyvinyl chloride slurry resin, a polyvinyl chloride resin having an average particle diameter of 2.98 μm, a degree of polymerization of 900, and a viscosity of 20,000 cps at 30° C. was used.

Embodiment 2

[0128] For the mixture of 65% by weight of polyvinyl chloride slurry resin and 35% by weight of trioctyl trimellitate (TOTM) with Newtonian fluid properties, in 100 parts by weight of the mixture, mix 1.0, 0.5, 0.4 The leveling agent of weight part is the EX-570 of Troy Company, the defoamer is the Foamstar A-10 of Corning Company, the viscosity modifier is hydroxymethyl cellulose, forms composition (2), and utilizes quantitative discharge pump to Composition (2) is discharged on the surface of the semiconductor wafer, and then the upper plate in the mold is pulled down, and at 150 ° C at 25TONf / cm 2 After performing thermocompression bonding, heat treatment was performed at 150° C. for 10 minutes, and then, the formed film was removed with a remover after the pressing was released.

Embodiment 3

[0130] For the mixture of 65% by weight of polyvinyl chloride slurry resin and 35% by weight of trioctyl trimellitate (TOTM) with Newtonian fluid properties, in 100 parts by weight of the mixture, mix 1.0, 0.5, 4.0 , 0.5, 1.0 and 2.0 parts by weight of the leveling agent is the EX-570 of Troy Company, the defoamer is the Foamstar A-10 of the Corning Company, the viscosity modifier is hydroxymethyl cellulose, and the anti-sedimentation agent is the BYK company BYK-405, heat stabilizer is BZ-806P of Song Yuan Industry, antistatic agent is polyvinyl alcohol 800 (PEG800) of Lotte Chemical to form composition (3), and use quantitative discharge pump to discharge composition (3) on the surface of the semiconductor wafer, then the upper plate inside the mold is pulled down, and at 150°C at 25TONf / cm 2 After performing thermocompression bonding, heat treatment was performed at 150° C. for 10 minutes, and then, the formed film was removed with a remover after the pressing was released....

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Abstract

The present invention relates to a coating composition and a method of forming a coating film using the same. More particularly, the present invention relates to a coating composition which is in the form of a liquid and which is capable of temporarily coating and protecting the surface during processing of objects such as semiconductor wafers or tempered glass, and being easily peeled off after processing, a coating film formed using the same, a method of producing the coating film, and a process for producing a semiconductor chip using the coating composition.

Description

technical field [0001] The present invention relates to a coating composition and a method for forming a coating film using the coating composition. More specifically, it relates to a liquid coating composition that is easily peeled off after processing by temporarily coating the surface to protect the surface when processing an object such as a semiconductor wafer or tempered glass. A coating film formed from the composition, a method for producing the coating film, and a process for producing a semiconductor chip using the coating composition. Background technique [0002] In recent years, with the development of the IT industry, the amount of semiconductor wafers and tempered glass used as the main components of IT equipment, various touch screens, circuit boards and other display materials has gradually increased. [0003] In particular, with the weight reduction and thinning of products and the high integration of semiconductor chips, there are increasing demands for r...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09D127/06C09D7/12B05D7/24B05D3/02
CPCB05D3/0218B05D3/0254B05D7/24B05D2320/00B05D2506/25C08K2201/014C08L2205/03C09D127/06C08L1/284C08K5/12C08L29/04C08K5/11C09D5/008C09D5/03C09D5/20H01L21/56H01L2924/35121
Inventor 裴圭锡朴完用
Owner K C TECH