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Substrate polishing method, top ring, and substrate polishing apparatus

A grinding method and technology of a grinding device, applied in the direction of grinding devices, grinding machine tools, grinding heads, etc., can solve problems such as improving the vacuum degree of the diaphragm

Active Publication Date: 2017-09-22
EBARA CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, instead of increasing the vacuum degree of the entire diaphragm, it may not be possible to reliably lift off

Method used

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  • Substrate polishing method, top ring, and substrate polishing apparatus
  • Substrate polishing method, top ring, and substrate polishing apparatus
  • Substrate polishing method, top ring, and substrate polishing apparatus

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no. 1 approach

[0063] figure 1 It is a schematic plan view of the substrate processing apparatus. This substrate processing device is used for semiconductor wafers with a diameter of 300mm or 450mm, flat panels, CMOS (Complementary Metal Oxide Semiconductor, Complementary Metal Oxide Semiconductor), CCD (Charge Coupled Device, Charge Coupled Device) and other image sensors, MRAM (Magnetic Random Access Memory, Various substrates are processed in the manufacturing process of the magnetic film of Magnetoresistive Random Access Memory).

[0064] The substrate processing apparatus includes: a substantially rectangular housing 100; a loading unit 200 for loading a substrate cassette storing many substrates; figure 1 In the shown mode, there are 4) substrate grinding devices 300; 1 or more (in figure 1 In the illustrated form, there are two) a substrate cleaning device 400 ; a substrate drying device 500 ; transport mechanisms 600 a to 600 d ; and a control unit 700 .

[0065] The loader 200 is...

no. 2 approach

[0112] The above-mentioned first embodiment is an embodiment in which the adsorption range is widened at the time of lift-off. However, depending on the circumstances, the substrate may be deformed by widening the adsorption range, and pressure may be applied to the substrate.

[0113] Figure 11 It is a graph measuring the amount of deformation of the substrate at the time of lift-off when the adsorption range is widened. Should Figure 11 It is a graph measured on a 300 mm substrate, the horizontal axis represents the position on the substrate, and the vertical axis represents the amount of deformation (however, the polishing pad 3a side, that is, the downward direction, is positive). As shown in the figure, the outer periphery of the substrate is greatly deformed. In addition, deformation occurred on the outside from a position approximately 100 mm from the center of the substrate, and pressure was applied to this position.

[0114] Therefore, in the second embodiment d...

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Abstract

The present invention provides a substrate polishing method, a substrate polishing apparatus, and a top ring for a substrate polishing apparatus capable of appropriately processing a substrate.The present invention provides a substrate polishing method comprising the steps of: a conveyance step (S2) in which a substrate is fed to a polishing pad by a first region of a flexible film; a grinding step (S4) in which the substrate is brought into contact with the polishing pad to grind the substrate in the polishing step (S4); and a lift-off step (S6) in which the substrate is lifted from the polishing pad by sucking the substrate by a second region wider than the first region of the elastic film in the lift step (S6) from.

Description

technical field [0001] The present invention relates to a substrate polishing method for polishing a substrate, a top ring for holding a substrate, and a substrate polishing apparatus provided with such a top ring. Background technique [0002] A general substrate polishing apparatus uses a top ring that holds a substrate, and polishes the substrate in the following procedure. First, the top ring receives the substrate from the transfer device, and transfers the substrate onto the polishing pad. Next, the top ring holding the substrate is lowered and the substrate comes into contact with the polishing pad. In this state, the top ring rotates the substrate to polish the substrate while supplying the polishing liquid. When the polishing is completed, the top ring is raised to separate and lift the substrate from the polishing surface of the polishing pad, which is called lift-off operation (for example, Patent Documents 1 and 2). In addition, the top ring holds the substrat...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B37/30B24B37/10H01L21/304
CPCB24B37/10B24B37/30H01L21/304B24B37/32B24B41/0475H01L21/30625H01L21/67092H01L21/67712H01L21/68721
Inventor 矶野慎太郎安田穗积并木计介锅谷治福岛诚富樫真吾山木晓
Owner EBARA CORP
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