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Intelligent ceramic plate bonding device for paper making

A technology for bonding devices and ceramic plates, which is applied to lamination devices, layered products, lamination, etc., can solve problems such as product quality impact, uneven thickness of the overall structure, uneven force on ceramic plates, etc., to reduce the number of times Product rate, the effect of avoiding cracking

Active Publication Date: 2017-09-29
HUAWEI TEHCHNOLOGIES CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] In order to facilitate paper forming, ceramics are bonded to glass substrates in the existing papermaking process. Existing bonding equipment directly coats the adhesive on the glass substrate and attaches the ceramic plate to the glass substrate. , during the natural solidification process, due to the uneven thickness of the coating adhesive or the uneven force on the ceramic plate, the thickness of the overall structure will be uneven, and the product quality will be affected during use.

Method used

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  • Intelligent ceramic plate bonding device for paper making
  • Intelligent ceramic plate bonding device for paper making
  • Intelligent ceramic plate bonding device for paper making

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] In this embodiment, in order to facilitate the placement of the glass plate, preferably, a support structure for placing the glass plate is provided inside the baffle, and a high-strength spring 118 is provided between the lower tray 117 and the base 101, Multiple groups of high-strength springs are vertically arranged, and the distance between adjacent high-strength springs is equal, so that the lower tray can be evenly stressed. The upper end surface of the lower tray 117 under the natural state of the high-strength spring 118 is higher than the upper end surface of the support plate 116. When the glass substrate and the ceramic plate are placed on the lower tray, the support plate 116 The upper end surface is lower than the lower end surface of the rotating shaft 107, and the ceramic plate is pressed down by the pressure rod, so that the ceramic plate is bonded to the glass substrate. When the pressure is applied, the high-strength spring is compressed to prevent the ...

Embodiment 2

[0024] In this embodiment, in order to facilitate the positioning of the glass substrate and the ceramic plate, preferably, positioning bolts 119 are respectively provided at both ends of the upper tray 110, and corresponding positioning holes are respectively provided on the glass substrate and the ceramic plate. , the positioning bolts 119 are threadedly connected to the upper tray 110, and the ends of the positioning bolts 119 protrude from the lower surface of the upper tray 110, so that the positioning bolts penetrate the positioning holes on the ceramic plate and the glass substrate, That is, the glass substrate and the ceramic plate can be kept relatively stable, thereby avoiding misalignment of the two. At the same time, after the positioning bolts are used to relatively fix the glass substrate and the ceramic plate, when the ceramic plate is extruded, excess adhesive can be squeezed into the positioning hole, thereby making the connection between the ceramic plate and ...

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PUM

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Abstract

The invention discloses an intelligent ceramic plate bonding device for paper making. The ceramic plate bonding device for paper making comprises a pedestal and 2 brackets arranged on the pedestal, wherein 2 baffles are arranged on the pedestal; a cavity for placing ceramics is formed between the 2 baffles; cambered through grooves are respectively arranged on both ends adjacent to the baffles; the inner sides of the cavity on the two ends of the baffles are respectively provided with a pressure plate; both sides of the middle parts of the pressure plates are respectively provided with a rotating shaft; the rotating shafts are rotatably connected to the baffles on the two sides; the upper end of each pressure plate is provided with a cross beam; both ends of each cross beam respectively penetrate through the through groove on the same side; and hydraulic gears are respectively arranged on the pedestal. A movable upper tray is utilized to implement mutual extrusion and bonding on the ceramics arranged in the cavity and the glass substrate, so that the extrusion is more uniform, and the ceramics and glass substrate can not easily rupture or form relative dislocation, thereby greatly reducing the subsequent processing difficulty.

Description

technical field [0001] The invention relates to a ceramic board bonding device for intelligent papermaking. Background technique [0002] In order to facilitate paper forming, ceramics are bonded to glass substrates in the existing papermaking process. Existing bonding equipment directly coats the adhesive on the glass substrate and attaches the ceramic plate to the glass substrate. , During the natural solidification process, due to the uneven thickness of the coating adhesive or the uneven force on the ceramic plate, the thickness of the overall structure will be uneven, and the product quality will be affected during use. Contents of the invention [0003] The purpose of the present invention is to provide a ceramic plate bonding device for intelligent papermaking, by using a movable upper tray to squeeze and bond the ceramics and glass substrates placed in the cavity, the extrusion is more uniform, and the ceramic and glass substrates It is not easy to break, and the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B37/00B32B37/12
CPCB32B37/0046B32B37/12
Inventor 叶彩
Owner HUAWEI TEHCHNOLOGIES CO LTD