Shock absorption type microhole punching mold

Abstract

The invention discloses a shock absorption type microhole punching mold which comprises a bottom plate. A supporting seat is mounted on the upper portion of the bottom plate. A lower mold seat is mounted on the upper portion of the supporting seat. Mounting holes are formed in the two ends of the upper portion of the lower mold seat. A guide sleeve is fixedly mounted in each mounting hole. A lower mold is mounted on the upper portion of the lower mold seat. An ejector plate is arranged on the upper portion of the lower mold. An upper mold seat is mounted at the bottom of the ejector plate. An upper mold is mounted at the bottom of the upper mold seat and located over the lower mold. Through holes are formed in the two ends of the top of the ejector plate. A guide column is connected in each through hole in a sleeved manner. An annular limiting shoulder table is arranged on the column segment of each guide column. Each guide column and the corresponding limiting shoulder table are of an integrated structure. A locking screw is mounted at the top end of each guide column. Each guide column and the ejector plate are in fastening connection through the corresponding locking screw. Each guide column is connected with a spring in a sleeved manner. According to the shock absorption type microhole punching mold, stability in the punching process and punching precision are improved.

Description

technical field [0001] The invention relates to the technical field of stamping dies, in particular to a shock-absorbing microporous stamping die. Background technique [0002] Stamping die is a special process equipment for processing materials (metal or non-metal) into parts (or semi-finished products) in cold stamping processing, called cold stamping die (commonly known as cold stamping die). Stamping is a pressure processing method that uses a mold installed on a press to apply pressure to the material at room temperature to cause separation or plastic deformation to obtain the required parts. [0003] Our common stamping dies generally apply the punch of the upper die directly to the lower die. In this way, the punch of the upper die will have a great impact and vibration on the lower die and the lower die seat. Such vibration is easy to occur on the lower die when punching. The displacement causes the phenomenon of eccentric punching, which affects the precision of pr...

AI Technical Summary

Problems solved by technology

[0003] Our common stamping dies generally apply the punch of the upper die directly to the lower die. In this way, the punch of the upper die will have a great impact and vibration on the lower die and the lower die seat. Such vibration is easy to occur on the lower die when punching. The displacement causes the punching to appear eccentric, which affects the processing accuracy

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