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High-frequency high-speed copper-clad laminate manufacturing method and copper-clad laminate

A manufacturing method and technology of copper-clad laminates, which are applied in chemical instruments and methods, circuit substrate materials, and other household appliances, can solve problems such as high dielectric constant, insufficient dimensional stability, and large dielectric loss

Active Publication Date: 2019-03-26
重庆德凯实业股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

With the high-speed and high-frequency of the electronic information industry and the increase of people's awareness of environmental protection, the existing copper clad laminates have been unable to meet the shortcomings of high dielectric constant, large dielectric loss, poor high temperature resistance, and insufficient dimensional stability. Use under high frequency conditions

Method used

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  • High-frequency high-speed copper-clad laminate manufacturing method and copper-clad laminate
  • High-frequency high-speed copper-clad laminate manufacturing method and copper-clad laminate
  • High-frequency high-speed copper-clad laminate manufacturing method and copper-clad laminate

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Experimental program
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Effect test

preparation example Construction

[0033] Preparation of prepregs: The treated NE glass fiber cloth and PPO / CE resin are prepared into prepregs after unit operations such as pre-impregnation, impregnation, exhaust, and drying in an impregnation machine.

[0034] Hot pressing molding: The prepared prepregs are stacked and combined, then sent to a hot press, and pressed and formed under high temperature and high pressure conditions.

[0035] The dielectric constant DK is the ratio of the capacitance when the electrodes are filled with a certain substance to the capacitance of a vacuum capacitor with the same structure, and usually indicates the ability of a certain material to store electrical energy. The current direction of the electrical signal passing through the printed board is usually positive and negative alternately, which is equivalent to the process of continuously charging and discharging the substrate. In interchange, the capacitance will affect the signal transmission speed. And this effect is more...

Embodiment 1

[0046] Put 12% low molecular weight polyphenylene ether, 10% bisphenol A cyanate resin and 53% xylene into a container, stir at 100°C until the solution is transparent; stop heating, and cool the solution to 60°C; Then add 5% dicumyl peroxide, 1% 2-ethyl-3-methylimidazole, 15% 4,4-diaminodiphenyl sulfone, 0.4% brominated epoxy resin, 0.4% aluminum borate crystal Whiskers, 1.0% aluminum hydroxide powder, and 2.2% acetone were heated and stirred under reflux at 130° C. for 2 hours, and then cooled to room temperature. The measured dielectric constant is 3.2, which meets the requirements.

Embodiment 2

[0048] Put 20% low molecular weight polyphenylene ether, 15% bisphenol A cyanate resin and 42% xylene into a container, stir at 100°C until the solution is transparent; stop heating, and cool the solution to 60°C; Then add 2% dicumyl peroxide, 0.5% 2-ethyl-3-methylimidazole, 12% 4,4-diaminodiphenyl sulfone, 1.2% brominated epoxy resin, 1% aluminum borate crystal Whiskers, 2% aluminum hydroxide powder, and 4.3% acetone were heated and stirred under reflux at 130° C. for 2 hours, and then cooled to room temperature. The measured dielectric constant is 3.0, which meets the requirements.

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Abstract

The invention provides a production method of a high-frequency and high-speed CCL (copper-clad plate). The production method comprises the following steps: low-molecular-weight PPO (polyphenylene oxide) and bisphenol A cyanate ester resin are subjected to mixed modification, and improved PPO / CE resin is prepared; the improved PPO / CE resin, filler and a flame retardant are processed and mixed in a certain ratio, and special glue for producing the high-frequency and high-speed CCL is prepared; a reinforcing material is pre-processed; pre-processed NE glass fiber cloth and the PPO / CE resin are subjected to operation by a preimpregnation unit, an impregnation unit, an exhaust unit, a drying unit and other units in an impregnation machine, and prepregs areprepared; the prepared prepregs are stacked in a staggered manner and assembled with a high-frequency VLP (very-low-profile) electrolytic copper foil, and the obtained assembly is subjected to compression molding in a heat machine at a high temperature and under high pressure. The high-frequency and high-speed CCL produced with the method has the advantages that other performance requirements of the CCL can be met under the condition that the dielectric constant and the dielectric loss factor are reduced, so that the CCL can be applied to production of high-frequency and high-speed printed circuit boards.

Description

technical field [0001] The invention relates to the technical field of copper-clad laminate preparation, in particular to a high-frequency and high-speed copper-clad laminate manufacturing method and the copper-clad laminate. Background technique [0002] In March 2017, my country's "Thirteenth Five-Year Plan" information industry development guideline proposed to "accelerate the promotion of 5G research and development, break through the core key technologies of 5G, support standard research and development and technology verification, actively promote the development of 5G international standards, and start 5G commercial use. services. Make my country one of the leading countries in 5G technology, standards, industries and applications.” With the high-speed and high-frequency of the electronic information industry and the increase of people's awareness of environmental protection, the existing copper clad laminates have been unable to meet the shortcomings of high dielectri...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B32B17/02B32B17/06B32B15/20B32B5/26B32B7/12B32B7/08B32B33/00B32B37/12B32B37/10B32B37/06B32B38/08C08L71/12C08L79/04C08L63/00C08K13/06C08K9/06C08K7/14C08K7/08C08K3/22C08K5/07C08K5/14C08J5/24H05K1/03H05K3/38
CPCB32B5/26B32B7/08B32B7/12B32B15/14B32B15/20B32B33/00B32B37/06B32B37/10B32B37/12B32B38/08B32B2037/1269B32B2260/023B32B2262/101B32B2307/20B32B2457/08C08J5/24C08J2371/12C08J2479/04C08K2003/2227C08L71/12C08L2201/02C08L2205/03H05K1/0366H05K3/386H05K2201/0166C08L79/04C08L63/00C08K13/06C08K9/06C08K7/14C08K7/08C08K3/22C08K5/07C08K5/14
Inventor 李洪彬
Owner 重庆德凯实业股份有限公司
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